68-PIN
Abstract: No abstract text available
Text: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-40 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-41 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-42 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-43
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64-Pin
68-Pin
64-Lead
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5962-96902
Abstract: No abstract text available
Text: WMS256K16-XXX HI-RELIABILITY PRODUCT 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 225)
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WMS256K16-XXX
256Kx16
MIL-STD-883
I/O9-16
A0-17
I/O16
I/O15
I/O14
5962-96902
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TBA 129-5
Abstract: WMS256K16L-XXX WMS256K16-XXX
Text: WMS256K16-XXX White Electronic Designs 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES PIN CONFIGURATION FOR WMS256K16-XXX • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging 44 FlatpacK • 44 pin Ceramic SOJ Package 102
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WMS256K16-XXX
256Kx16
MIL-STD-883
256Kx16
I/O9-16
WMS256K16L-XXX
01HNX
02HNX
03HNX
TBA 129-5
WMS256K16-XXX
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WMS256K16L-XXX
Abstract: WMS256K16-XXX
Text: WMS256K16-XXX HI-RELIABILITY PRODUCT 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 225)
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WMS256K16-XXX
256Kx16
MIL-STD-883
256Kx16
WMS256K16L-XXX
I/O9-16
A0-17
01HNX
02HNX
WMS256K16-XXX
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TBA 129-5
Abstract: WMS256K16L-XXX WMS256K16-XXX
Text: White Electronic Designs WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ PIN CONFIGURATION FOR WMS256K16-XXX 44 CSOJ Packaging 44 FlatpacK • 44 pin Ceramic SOJ Package 102
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WMS256K16-XXX
256Kx16
MIL-STD-883
256Kx16
I/O9-16
WMS256K16L-XXX
01HNX
02HNX
03HNX
TBA 129-5
WMS256K16-XXX
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Untitled
Abstract: No abstract text available
Text: WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 PIN CONFIGURATION FOR WMS256K16-XXX FEATURES Access Times 17, 20, 25, 35ns MIL-STD-883 Compliant Devices Available 44 CSOJ Packaging • 44 pin Ceramic SOJ Package 102 44 FlatpacK
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WMS256K16-XXX
256Kx16
MIL-STD-883
256Kx16
I/O9-16
WMS256K16L-XXX
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5962-89598
Abstract: EDI88128CS
Text: White Electronic Designs EDI88128CS 128Kx8 Monolithic SRAM, SMD 5962-89598 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns • 32 pad Ceramic LCC Package 141 CS# and OE# Functions for Bus Control • 32 lead Ceramic Flatpack (Package 142) 2V Data Retention (EDI88128LPS)
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EDI88128CS
128Kx8
EDI88128LPS)
EDI88128CS
128Kx8
MIL-STD-883
5962-89598
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5962-89598
Abstract: EDI88128CS
Text: White Electronic Designs EDI88128CS 128Kx8 Monolithic SRAM, SMD 5962-89598 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns • 32 pad Ceramic LCC Package 141 CS# and OE# Functions for Bus Control • 32 lead Ceramic Flatpack (Package 142)
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EDI88128CS
128Kx8
EDI88128LPS)
EDI88128CS
128Kx8
MIL-STD-883
5962-89598
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Z84C0010PEC
Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
Text: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)
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CPS95CO0125
Z84C0010PEC
MIL-STD-883C
CPS95CO0125
84C00
10X10
Z84C90
64 CERAMIC LEADLESS CHIP CARRIER LCC
ceramic QFP Package 100 lead
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Untitled
Abstract: No abstract text available
Text: WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 PIN CONFIGURATION FOR WMS256K16-XXX FEATURES Access Times 17, 20, 25, 35ns MIL-STD-883 Compliant Devices Available 44 CSOJ Packaging • 44 pin Ceramic SOJ Package 102 44 FlatpacK
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WMS256K16-XXX
256Kx16
MIL-STD-883
256Kx16
I/O9-16
WMS256K16L-XXX
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WS512K16-XXX
Abstract: TBA 129-5
Text: WS512K16-XXX 512Kx16 SRAM MODULE ADVANCED* FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 209) ■ Organized as two banks of 256Kx16
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WS512K16-XXX
512Kx16
MIL-STD-883
256Kx16
I/O9-16
512K16
WS512K16-XXX
TBA 129-5
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CERAMIC QUAD FLATPACK CQFP
Abstract: CQFP 240
Text: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most
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GA98111PDF2/99
CERAMIC QUAD FLATPACK CQFP
CQFP 240
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xc68360
Abstract: No abstract text available
Text: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.
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5998AL,
5998AL-1
5998AL-2
Goldberg\FlukeDataSheet\d5998AL
xc68360
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L1A4474
Abstract: L1A4 k1698
Text: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.
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5998AL,
5998AL-1
5998AL-2
00\D5998AL
L1A4474
L1A4
k1698
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1010-1018
Abstract: MO-078AA OM8500SC OM8500SCH OM8500SCP OM8500SF OM8500SFH OM8500SFP
Text: PD-94465A Low Dropout Linear Regulator Hermetic Package OM8500SC OM8500SF +3.3Vin to +1.8Vout at 3.0A Product Summary Part Number OM8500SC OM8500SF IO 3.0A 3.0A Vin 3.3V 3.3V Vout 1.8V 1.8V Package MO-078AA 8-lead Flatpack MO-078AA Features: The OM8500 is a low dropout linear regulator designed
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PD-94465A
OM8500SC
OM8500SF
MO-078AA
OM8500
LoMIL-PRF-38534
MIL-PRF-38534
1010-1018
MO-078AA
OM8500SC
OM8500SCH
OM8500SCP
OM8500SF
OM8500SFH
OM8500SFP
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1010-1018
Abstract: MO-078AA OM8503SC OM8503SCH OM8503SCP OM8503SF OM8503SFH OM8503SFP
Text: PD-94468A Ultra Low Dropout Linear Regulator Hermetic Package OM8503SC OM8503SF +7.4Vin to +6.8Vout at 3.0A Product Summary Part Number OM8503SC OM8503SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 7.4V 7.4V Vout 6.8V 6.8V Package MO-078AA 8-lead Flatpack MO-078AA
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PD-94468A
OM8503SC
OM8503SF
MO-078AA
OM8503
sigMIL-PRF-38534
MIL-PRF-38534
1010-1018
MO-078AA
OM8503SC
OM8503SCH
OM8503SCP
OM8503SF
OM8503SFH
OM8503SFP
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MO-078AA
Abstract: OM8501SC OM8501SCH OM8501SCP OM8501SF OM8501SFH OM8501SFP
Text: PD-94466A Ultra Low Dropout Linear Regulator Hermetic Package OM8501SC OM8501SF +3.3Vin to +2.5Vout at 3.0A Product Summary Part Number OM8501SC OM8501SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 3.3V 3.3V Vout 2.5V 2.5V Package MO-078AA 8-lead Flatpack MO-078AA
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PD-94466A
OM8501SC
OM8501SF
MO-078AA
OM8501
ouMIL-PRF-38534
MIL-PRF-38534
MO-078AA
OM8501SC
OM8501SCH
OM8501SCP
OM8501SF
OM8501SFH
OM8501SFP
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MO-078AA
Abstract: OM8504SFP 1010-1018 OM8504SC OM8504SCH OM8504SCP OM8504SF OM8504SFH
Text: PD-94469A Ultra Low Dropout Positive Adjustable Linear Regulator Hermetic Package OM8504SC OM8504SF + 3.3Vin at 3.0A Product Summary Part Number OM8504SC OM8504SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin Package 3.3V MO-078AA 3.3V 8-lead Flatpack MO-078AA Features:
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PD-94469A
OM8504SC
OM8504SF
MO-078AA
OM8504
MIL-PRF-38534
MIL-PRF-38534
MO-078AA
OM8504SFP
1010-1018
OM8504SC
OM8504SCH
OM8504SCP
OM8504SF
OM8504SFH
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MO-078AA
Abstract: OM8506SC OM8506SCH OM8506SCP OM8506SF OM8506SFH
Text: PD-94471A Ultra Low Dropout Adjustable Linear Regulator Hermetic Package OM8506SC OM8506SF +7.5Vin / +6.1 to +7.0Vout at 3.0A Product Summary Part Number OM8506SC OM8506SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin Package 7.5V MO-078AA 7.5V 8-lead Flatpack MO-078AA
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PD-94471A
OM8506SC
OM8506SF
MO-078AA
OM8506
volMIL-PRF-38534
MIL-PRF-38534
MO-078AA
OM8506SC
OM8506SCH
OM8506SCP
OM8506SF
OM8506SFH
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Untitled
Abstract: No abstract text available
Text: HS-80C85RH HARRIS S E M I C O N D U C T O R Radiation Hardened 8-Bit CMOS Microprocessor September 1995 Features Pinouts 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T40 TOP VIEW U xi [T m VD D • Radiation Hardened EPI-CMOS
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HS-80C85RH
MIL-STD-1835
CDIP2-T40
038mm)
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Untitled
Abstract: No abstract text available
Text: yjj S u p er t e x inc. Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack MIL-STD-883 Processed* HV33
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HV3304DJ
HV3304PJ
MIL-STD-883
RBHV3304DJ
HV3304X
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Untitled
Abstract: No abstract text available
Text: b lE SUPERTEX INC T> m 07732*15 0 0 0 3 3 4 7 Û13 * S T X HV33 Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information_ _ Package Options Device 66 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack
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HV3304DJ
HV3304PJ
HV3304X
MIL-STD-883
RBHV3304DJ
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Untitled
Abstract: No abstract text available
Text: SUPERTEX 3SE D INC • 07732=15 Q D G 2 5 G 0 1 B I S T X Preliminary ~T-5f~/5 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options * Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack
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MIL-STD-883
HV3304DJ
HV3304PJ
HV3304X
RBHV3304DJ
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2 010 073 007
Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Text: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a
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