HXC125
Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The
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1654563-CC
CE-PDF-07-08
HXC125
mm1764
1-1640294-0
1mm pitch BGA socket
1024 ball bga
1640302-3
MM1089
441 ball bga
bga 1296
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construction of photo diode
Abstract: BGA 441 EH11 au 81 441 ball bga flip chip bga 0,8 mm
Text: Multi Chip Module MCMC SP Chip size package Advanced semiconductor mounting CSP is realized by Hybrid IC technology Realize high accumulation and a low price by fine printed substrate. CSP Features Single / Multi layer printed substates with minimum line width
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E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS577G
E700G
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441 ball bga
Abstract: eh11 BGA 441 bga 0,8 mm
Text: マルチチップモジュール MCM・CSP（チップサイズパッケージ） 究極の半導体実装CSPと, MCMをハイブリッドIC 技術で実現し 高集積化と低コスト化をファイン印刷基板で実現しました。 ▲ 特 長
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BGA-56 DATASHEET
Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3
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Abstract: No abstract text available
Text: CS2111 MADRID – Dual-Ring RPR MAC IC OVERVIEW MADRID is an integrated dual-ring RPR MAC. It provides an efficient solution for high-density line cards in ADMs, MSPPs, Switches and Routers. FEATURES Functionality Compliant with 802.17 standard
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CS2111
10Gb/s
F2111010204
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Untitled
Abstract: No abstract text available
Text: CS2111 MADRID – Dual-Ring RPR MAC IC OVERVIEW MADRID is an integrated dual-ring RPR MAC. It provides an efficient solution for high-density line cards in ADMs, MSPPs, Switches and Routers. FEATURES Functionality Compliant with 802.17 standard
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CS2111
10Gb/s
F2111010204
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Untitled
Abstract: No abstract text available
Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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footprint 8M1-A
Abstract: 196-pin bga footprint
Text: BGA Footprints Arranged by Pitch and Ball Count See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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BGA reflow guide
Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using
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N163MZ163
N130MZ327
N161MZ612
N169MZ365
N169MZ641
N158MZ395
BGA reflow guide
"IR Sensor"
ir heat sensor
pcb thermal Design guide trace theta layout
BGA PROFILING
Soldering and desoldering
1mm pitch BGA
BE 4X12
hot air bga
paste profile
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wristwatch
Abstract: 441-pin BGA
Text: CSP,MCM Modules CSP,MCM Modules AV, OA Information, Mobile communication, Industry/Field: Industrial equipment Breakthrough in High-Density Mounting High-Density Mounting via 20µm Fine Printed substrate • Development goals: Manufacture of high-density modules for
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100nH
10pF/mm2
3000pF/mm2
wristwatch
441-pin BGA
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SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
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025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
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"sd1v4
Abstract: Fusion-MPT Message Passing Interface Specification LSI53C1020A LSI53C1000
Text: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.3 DB14-000176-05 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties
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LSI53C1020/1020A
Ultra320
DB14-000176-05
DB14-000176-05,
LSI53C1020
LSI53C1020A
"sd1v4
Fusion-MPT Message Passing Interface Specification
LSI53C1000
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LSI53C1020A
Abstract: LSI53C1020 DB14-000176-06 Fusion-MPT Message Passing Interface Specification LSI53C1000
Text: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.4 DB14-000176-06 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties
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LSI53C1020/1020A
Ultra320
DB14-000176-06
DB14-000176-06,
LSI53C1020
LSI53C1020A
DB14-000176-06
Fusion-MPT Message Passing Interface Specification
LSI53C1000
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XC95216-20PQG160I
Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but
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XC95216
352-pin
XC95288
XCN07010
352-pin
XC95216-20PQG160I
XC95216-15PQ160I
471 E25
XC95216 Family
XC95216-10PQ160C
XC95216-10PQ160I
XC95216-15PQG160C
XC95216-15PQG160I
XC95216-10PQG160I
XC9500
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atmel 946
Abstract: atmel 946 8 pin MH1RT QML military mcm 1553 0.6 um cmos process atmel 27 Series
Text: 200 ASICs for Aerospace i n t e g r a t i o n s o l u t i o n s System Level Integration for the space market R aerospace S y s t e m Meeting communication satellite challenges tmel Wireless & Microcontollers A the way for System Level Integration. hardened VLSI products for space
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perf89
32-bit
atmel 946
atmel 946 8 pin
MH1RT QML
military mcm 1553
0.6 um cmos process
atmel 27 Series
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LSI53C1020A
Abstract: ARM966E-S CRC-32 LSI53C1000R LSI53C1020 PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification
Text: TECHNICAL MANUAL LSI53C1020 PCI-X to Ultra320 SCSI Controller June 2002 Version 2.0 DB14-000176-02 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties
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LSI53C1020
Ultra320
DB14-000176-02
DB14-000176-02,
LSI53C1020A
ARM966E-S
CRC-32
LSI53C1000R
PAR64
KY 719
"sd1v4
SD1V
Fusion-MPT Message Passing Interface Specification
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of 1000 microfarad electrolytic capacitor
Abstract: JTAG series termination resistors
Text: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.
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UG002
of 1000 microfarad electrolytic capacitor
JTAG series termination resistors
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diagrams hitachi ecu
Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
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D-85622
REJ01K0003-0200Z
diagrams hitachi ecu
SMD Transistor
exposed QFP 128
784-pin
HQFP1414-64
QFN Thermal Resistance vs. Mounting Pad Area
LFPAK footprint Renesas
LFPAK footprint
QFP PACKAGE thermal resistance
"General Catalog"
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35 x 35 PBGA, 580 100 balls
Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8
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C13550EJ1V0PF00
35 x 35 PBGA, 580 100 balls
Enplas drawings
HG7900
BGA Ball Crack
153pin
NEC stacked CSP 2000
PEAK TRAY bga
BGA-35
Lead Free reflow soldering profile BGA
NEC stacked CSP
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Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
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26x26
15X15
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uaa 3100
Abstract: uaa 4003 s0315 v 3700 bga
Text: ADVANCED BGA Footprints A rranged by Pitch and Ball Count . INTERCONNECTIONS. See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
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