TSSOP 8PIN MARK 21
Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP
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Original
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SC-82AB
SC-88A
OT-23-3
OT-23-5
OT-23-6
OT-89-3
OT-89-5
14-Pin
10-Pin
16-Pin
TSSOP 8PIN MARK 21
land pattern for TSsOP 16
6pin
land pattern for TSsOP 8
2952 8pin
HA005-A-P
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PDF
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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Original
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.58 TYP. 5/Oct.13,1998
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OP24-P-430-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP32-P-525-1.27-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 1.32 TYP. 5/Feb.10,1997
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Original
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OP32-P-525-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP8-P-250-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.10 TYP. 4/Dec. 5, 1996
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Original
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OP8-P-250-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP24-P-430-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.58 TYP. 5/Oct. 13, 1998
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Original
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OP24-P-430-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP16-P-300-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.21 TYP. 3/Dec. 5, 1996
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Original
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OP16-P-300-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP44-P-600-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 2.10 TYP. 4/Dec. 5, 1996
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Original
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OP44-P-600-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP28-P-430-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.75 TYP. 4/Dec. 5, 1996
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Original
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OP28-P-430-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP32-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.32 TYP. 5/Fev. 10, 1997
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Original
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OP32-P-525-1
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PDF
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Untitled
Abstract: No abstract text available
Text: SOP40-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 3/Oct. 21, 1996
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OP40-P-525-1
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PDF
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Untitled
Abstract: No abstract text available
Text: 28 PIN PLASTIC SOP 450 mil 28 15 1 5°±5° detail of lead end 14 A G H I E K F J C D L B N M M P28GM-50-450A1-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS
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Original
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P28GM-50-450A1-2
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PDF
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MM225-1A
Abstract: SC-527-8AA sc5278
Text: Mounting Pad Packing Magazine Name MM225-1A 8 pin SOP 225 mil 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS
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Original
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MM225-1A
S8GM-50-225B-4
SC-527-8AA*
MM225-1A
SC-527-8AA
sc5278
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PDF
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Untitled
Abstract: No abstract text available
Text: 8 PIN PLASTIC SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM
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P8GM-50-300B-4
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VAA33
Abstract: Murata EMI Filter ADV7120
Text: BACK a FEATURES 80 MHz Pipelined Operation Triple 8-Bit D/A Converters RS-343A/RS-170 Compatible Outputs TTL Compatible Inputs +5 V CMOS Monolithic Construction 40-Pin DIP or 44-Pin PLCC and 48-Lead TQFP APPLICATIONS High Resolution Color Graphics CAE/CAD/CAM Applications
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RS-343A/RS-170
40-Pin
44-Pin
48-Lead
ADV7120
ST-48)
VAA33
Murata EMI Filter
ADV7120
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PDF
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adv7120
Abstract: R3G310 ADV7120KN30 ADV7120KN50 ADV7120KN80 ADV7120KP50 ADV7120KP80 RS-170 RS-343A Composite Sync
Text: a FEATURES 80 MHz Pipelined Operation Triple 8-Bit D/A Converters RS-343A/RS-170 Compatible Outputs TTL Compatible Inputs +5 V CMOS Monolithic Construction 40-Pin DIP or 44-Pin PLCC and 48-Lead TQFP APPLICATIONS High Resolution Color Graphics CAE/CAD/CAM Applications
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Original
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RS-343A/RS-170
40-Pin
44-Pin
48-Lead
ADV7120
ST-48)
adv7120
R3G310
ADV7120KN30
ADV7120KN50
ADV7120KN80
ADV7120KP50
ADV7120KP80
RS-170
RS-343A
Composite Sync
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PDF
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Untitled
Abstract: No abstract text available
Text: 8-PIN PLASTIC SOP 7.62 mm (300 8 5 detail of lead end P 1 4 A H F I G J S L B C D M N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 6.44 +0.21 −0.1 B 1.42 MAX.
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P8GM-50-300B-6
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PDF
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S8GM-50-225B-6
Abstract: No abstract text available
Text: 8-PIN PLASTIC SOP 5.72 mm (225 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX.
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S8GM-50-225B-6
S8GM-50-225B-6
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PDF
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transistor 331
Abstract: transistor h 331 datasheet SC-533-28CA C 331 Transistor transistor h 331 LB-001
Text: Mounting Pad Packing Name Magazine LB-001 28 pin SOP 450 mil 28 15 1 5°±5° detail of lead end 14 A G H I E K F J C D L B N M M P28GM-50-450A1-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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LB-001
P28GM-50-450A1-2
RefereP28GM-50-450A1-2
SC-533-28CA*
transistor 331
transistor h 331 datasheet
SC-533-28CA
C 331 Transistor
transistor h 331
LB-001
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PDF
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Untitled
Abstract: No abstract text available
Text: 32 PIN PLASTIC SOP 525 mil 32 17 1 5°±5° detail of lead end 16 A J E K F G H I C D L B N M M S32GM-50-525A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES
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S32GM-50-525A-2
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PDF
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Untitled
Abstract: No abstract text available
Text: 40 PIN PLASTIC SOP 525 mil 40 21 5°±5° detail of lead end 1 20 H A J E K F G I N C D L B M M P40GW-50-525A NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maxi– mum material condition. ITEM MILLIMETERS
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P40GW-50-525A
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PDF
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Untitled
Abstract: No abstract text available
Text: 16 PIN PLASTIC SOP 375 mil 16 9 5°±5° detail of lead end 1 8 A G H I E K F J D L B C N M M P16GM-50-375A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES
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Original
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P16GM-50-375A-2
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PDF
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Untitled
Abstract: No abstract text available
Text: 24 PIN PLASTIC SOP 450 mil 24 13 1 5°±5° detail of lead end 12 A H J E K F G I D L B C N M M P24GM-50-450A-2 NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES
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Original
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P24GM-50-450A-2
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PDF
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Untitled
Abstract: No abstract text available
Text: 14 PIN PLASTIC SHRINK SOP 225 mil 14 8 5˚±5˚ detail of lead end 1 7 A H I E K F G J B C D L N M M P14GM-65-225B-2 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS
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P14GM-65-225B-2
071MAX.
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