533602B02552G Search Results
533602B02552G Price and Stock
BOYD Laconia 533602B02552GBOARD LEVEL HEAT SINK |
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533602B02552G | Bulk | 1,000 |
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Boyd Corporation 533602B02552GHeat Sink Passive TO-220 Radial Solder Pin/Clip 3.8?C/W Black Anodized (Alt: 041764) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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533602B02552G | 16 Weeks | 1,000 |
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533602B02552G | Bulk | 1,000 |
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533602B02552G | Bulk | 1,000 |
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533602B02552G | 18 Weeks | 1,000 |
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533602B02552G Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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533602B02552G |
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Thermal - Heat Sinks, Fans, Thermal Management, BOARD LEVEL HEAT SINK | Original |
533602B02552G Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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533602B02552G
Abstract: No abstract text available
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533602B02552 533602B02552G 533602B02552G | |
533602b02552g
Abstract: No abstract text available
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O-220 O-220 600802F00000 600502F00000 600552F00000 605201F00000 627253B06000* 623351F00000 607601F00000 610851F00000 533602b02552g | |
Board Level
Abstract: SMT a 103g bgs2 09ng NAS 6604 ASTM D1829 6021PBG 6399B-P2G 125800D00000G TV47G
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