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BPM Microsystems Inc FASMR256FBGAC SOCKET MODULE, 256 PIN BGA; B=17
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FASMR256FBGAC				1	1 $1872.97 10 $1872.97 100 $1872.97 1000 $1872.97 10000 $1872.97	Buy Now

56FBGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
K4T2G264QA Abstract: RESISTOR 820 OHM Text: RDIMM DDR2 SDRAM DDR2 Registered SDRAM MODULE 240pin Registered Module based on 1Gb A-die 72-bit ECC 68FBGA & 56FBGA with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.	Original	240pin 72-bit 68FBGA 56FBGA K4T2G264QA RESISTOR 820 OHM	PDF
Untitled Abstract: No abstract text available Text: RDIMM DDR2 SDRAM DDR2 Registered SDRAM MODULE 240pin Registered Module based on 1Gb A-die 72-bit ECC 68FBGA & 56FBGA with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.	Original	240pin 72-bit 68FBGA 56FBGA	PDF
Untitled Abstract: No abstract text available Text: MX29GL512F MX29GL512F DATASHEET P/N:PM1617 REV. 1.6, OCT. 30, 2013 1 MX29GL512F Contents FEATURES. 5	Original	MX29GL512F PM1617	PDF
K8P3215UQB Abstract: K8P2815 K8p3215 K8P3215U k8p2815u K8P32 48FBGA samsung nor flash Samsung MCP K8P6415 Text: K8P3215UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,	Original	K8P3215UQB 10MAX 48FBGA 48-PIN 1220F 047MAX K8P3215UQB K8P2815 K8p3215 K8P3215U k8p2815u K8P32 samsung nor flash Samsung MCP K8P6415	PDF
k 1358 Abstract: 56FBGA Text: 32 Mbit Burst Mode Concurrent SuperFlash ComboMemory SST34WA32A3 / SST34WA32A4 / SST34WA3283 / SST34WA3284 Advance Information FEATURES: • Flash Organization: – 2M x 16 • PSRAM Organization: – 8 Mbit: 512k X 16 – 16 Mbit: 1M x 16 • Single Voltage Read and Write Operations	Original	SST34WA32A3 SST34WA32A4 SST34WA3283 SST34WA3284 SST34WA32x3 SST34WA32x4 MO-225, 56-fbga-MVN-6x8-1 56-Ball S71358-01-000 k 1358 56FBGA	PDF
MX29GL256F Abstract: MX29GL256FHT2I-90Q MX29GL256FLT2I-90Q TSOP 62 Package MX29GL256FLT2i Text: MX29GL256F MX29GL256F DATASHEET P/N:PM1544 REV. 1.3, JAN. 12, 2012 1 MX29GL256F Contents FEATURES. 5	Original	MX29GL256F MX29GL256F PM1544 MX29GL256FHT2I-90Q MX29GL256FLT2I-90Q TSOP 62 Package MX29GL256FLT2i	PDF
Untitled Abstract: No abstract text available Text: MX29GL128F MX29GL128F DATASHEET P/N:PM1683 REV. 1.4, OCT. 30, 2013 1 MX29GL128F Contents FEATURES. 5	Original	MX29GL128F PM1683	PDF
MX29GL512 Abstract: MX29GL512FHT MX29GL512FUXFI-12G MX29GL512FHXFI-11 MX29GL512FLT2 Q8-Q14 Text: MX29GL512F MX29GL512F DATASHEET P/N:PM1617 REV. 1.4, JUL. 31, 2012 1 MX29GL512F Contents FEATURES. 5	Original	MX29GL512F MX29GL512F PM1617 MX29GL512 MX29GL512FHT MX29GL512FUXFI-12G MX29GL512FHXFI-11 MX29GL512FLT2 Q8-Q14	PDF
1f1-1717-a19 Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.115.1 812 ,256M DDR 5G 60WMBG Package 812 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.09.0(816) 816 130℃ MAX 48-TBGA-10.0X9.0-8X16-O	Original	60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9	PDF
PD78F9224 Abstract: PD78F0840 PD78F1818 PD78F1201 PD78F0841 PD78F1213 PD780023A PD78F0712 PD78F1036 PD78F1841 Text: www.renesas.com 2010.11 78Kマイクロコントローラセレクションガイドルネサスマイクロコンピュータルネサスマイクロコンピュータ 78Kマイクロコントローラセレクションガイド 2005, 2010. Renesas Electronics Corporation, All rights reserved. Printed in Japan.	Original	R01CL0007JJ0200 78K0S 10-SSOP PD78F9502 PD78F9501 78K0/Kx2, 78K0/Fx2, 78K0/Lx3 78K0/Ix2, 78K0/Kx2-L PD78F9224 PD78F0840 PD78F1818 PD78F1201 PD78F0841 PD78F1213 PD780023A PD78F0712 PD78F1036 PD78F1841	PDF
K9F2G08U0B Abstract: K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage January 2009 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM	Original	BR-09-ALL-001 K9F2G08U0B K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B	PDF
R8A77343DA00BG Abstract: R5F61725 MINI DX3 READER HEAD WIRING DIAGRAM R5F64218 R4F2113 HD6412240FA20V R8A77343DA0FBG R8A77310D333BG R8A77343DA06BG HD6417032F20V Text: 2011.06 Renesas Microcomputer General Catalog www.renesas.com CONTENTS Lineup 3 Renesas Development Environment 5 Application Matrix 7 SuperH Family 15 V850 MCUs 59 M32R Family 76 RX Family 78 RL78 Family 96 R8C Family 112 78K MCUs 164 M16C Family 221 H8SX Family	Original	R01CS0001EJ0201 R8A77343DA00BG R5F61725 MINI DX3 READER HEAD WIRING DIAGRAM R5F64218 R4F2113 HD6412240FA20V R8A77343DA0FBG R8A77310D333BG R8A77343DA06BG HD6417032F20V	PDF
atc 93lc46 Abstract: 25LV512 39SF020A 25LV010 49LF040 25LF020A 95p08 89lpc932 nt68f63g 39vf020 Text: LabTool-48XP Version 5.60 <ALL> Device List Page 1 of 23 ACTRANS AC29LV400B 44PS AC39VF080 40TS AC29LV400B 48TS AC39VF088 48TS AC29LV400T 44PS AC39VF800 48TS AC29LV400T 48TS ALi M6759 M6759 44 M6759 44Q M8720 Alliance AS29F040 AS29LV800T 48TS AS29LV400B *48TS	Original	LabTool-48XP AC29LV400B AC39VF080 AC39VF088 AC29LV400T AC39VF800 M6759 atc 93lc46 25LV512 39SF020A 25LV010 49LF040 25LF020A 95p08 89lpc932 nt68f63g 39vf020	PDF
Untitled Abstract: No abstract text available Text: MX29GL256F MX29GL256F DATASHEET P/N:PM1544 REV. 1.5, OCT. 30, 2013 1 MX29GL256F Contents FEATURES. 5	Original	MX29GL256F PM1544	PDF

samsung 2GB X16 Nand flash Abstract: SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH Text: Multi-Chip Package Technology from Samsung The ultimate memory solution for mobile devices MCPs: New Memory Solution for Today’s Handhelds As the popularity of handheld electronic devices continues to expand, the Best Source for MCPs memory solution of choice for designers of these products has become	Original	BR-06-MEM-001 samsung 2GB X16 Nand flash SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH	PDF
A25L020AO-F Abstract: rtd2122l n25q128a13 cFeon EN25T80 EN25T80 wt61p8 A25L5120-F WT6702F pm25w020 GD25Q40 Text: Page 1 of 69 Dataman-48XP/48UXP Version 8.10 <ALL> Device List ACTRANS AC25LV010 8SO AC29LV400B 44PS AC29LV400T 44PS AC39LV010 32PLCC AC39LV020 32PLCC AC39LV040 32PLCC AC39LV080 40TS AC39LV512 32PLCC AC39LV800 *48TS SDP-UNIV-16SO SDP-UNIV-44PS SDP-UNIV-44PS	Original	Dataman-48XP/48UXP AC25LV010 AC29LV400B AC29LV400T AC39LV010 32PLCC AC39LV020 AC39LV040 A25L020AO-F rtd2122l n25q128a13 cFeon EN25T80 EN25T80 wt61p8 A25L5120-F WT6702F pm25w020 GD25Q40	PDF
Untitled Abstract: No abstract text available Text: MX29GL512F MX29GL512F DATASHEET P/N:PM1617 REV. 1.7, FEB. 26, 2014 1 MX29GL512F Contents FEATURES. 5	Original	MX29GL512F PM1617	PDF
K9F2G08U0C Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0 Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM	Original	BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0	PDF
K9HDG08U1A Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks	Original	BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe	PDF
sharp mask rom Abstract: No abstract text available Text: MEMORIES Combination Memories ★ Under development • SRAM +Flash Memory Stacked TSOP Capacity SK configuration 1M SRAM X 4M FLASH X 8 8 LR-S13011 LR-S1302 1MSRAM X 8M FLASH X 8 8 1MSRAM X 16 8M FLASH vA 1O Block) 2M SRAM 1 1 1 1 1 8M FLASH 1 1 1 BM FLASH	OCR Scan	LR-S13011 LR-S1302 LR-S1304 LR-S1303 LR-S1313 LR-S1306 LR-S1305A LR-S1307 56FBGA 72FBGA sharp mask rom	PDF

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56FBGA Search Results

56FBGA Price and Stock

BPM Microsystems Inc FASMR256FBGAC

56FBGA Datasheets Context Search

K4T2G264QA

Untitled

Untitled

K8P3215UQB

k 1358

MX29GL256F

Untitled

MX29GL512

1f1-1717-a19

PD78F9224

K9F2G08U0B

R8A77343DA00BG

atc 93lc46

Untitled

samsung 2GB X16 Nand flash

A25L020AO-F

Untitled

K9F2G08U0C

K9HDG08U1A

sharp mask rom