NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES
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C10943XJ6V0IF00
IEI-635,
IEI-1213)
ED-7411
NEC A39A
NEC A39A 240
SOP28 330 mil land pattern
NEC A39A 8 PIN
mjh 106
120-PIN 282 185 01
smd TRANSISTOR code b6
ED-7500
transistor a39a
SIP 400B
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Untitled
Abstract: No abstract text available
Text: Thin Shrink Small Outline Package TSSOP DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface
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AK64D600-TSSOP
AK80D900-TSSOP
TSSOP08)
AK80D900-QVSOP
TSSOP09)
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oki naming format
Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Text: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by
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ED-7401-2
oki naming format
DIP42-P-600-2
HQFP208-P-4040-0
R400
S115
0.65mm pitch BGA
PLCC DIMENTIONS
oki marking 20 soj
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SIP 400B
Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)
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follow100A7-1
X280RF-100A-2
X280RF-100A1-1
X280RF-100A2-1
X280RF-100A3-1
X280RF-100A4
X280RF-100A5
X364RF-100A-1
X179RP-100A
X447RP-50A
SIP 400B
24-Pin Plastic DIP
Shrink Zig-Zag In-line Package
600A
CERAMIC PIN GRID ARRAY 120 pins
PGA data sheet pin count
P20V-254A-2
P64E-70-A-1
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"leadframe material" DIP
Abstract: "leadframe material" DIP 20 K 1357 C1995 leadframe materials an-469 national
Text: National Semiconductor Application Note 469 R James Walker October 1986 ABSTRACT New space efficient packages for integrated circuits have been developed These include the Plastic Chip Carrier P C C and Small Outline (S O ) packages Design considerations and reliability tests for the S O package were compared to the standard plastic Dual-in-Line Package (DIP)
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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ZD 607
Abstract: sot101b sot158a 0020A2
Text: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - DIP LQFP SIL SO SSOP SQFP TAB VSO - Soldering - Package outlines Package information 1995 Sep 06 File under Integrated Circuits, IC12 Philips Semiconductors Package information
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DIP16
DIP20
DIP24
DIP28
DIP40
OT97-1;
OT38-1;
OT146X
OT314-2
ZD 607
sot101b
sot158a
0020A2
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14.5M 1982
Abstract: No abstract text available
Text: IRG4RC10U 9 0% 10 % VC 9 0% Fig. 14b - Switching Loss t d off 10 % IC 5% Waveforms tf tr t d( on ) t=5µ s E on E o ff E ts = ( Eon +E off ) Package Outline D-PAK Outline Dimensions are shown in millimeters (inches) 2.38 (.094) 2.19 (.086) 6.73 (.265)
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IRG4RC10U
14.5M 1982
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led diode 5mm
Abstract: No abstract text available
Text: Package Line-up Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Package Lead Outline pitch TO-92 1.27mm TO-220F 2.54mm SIP 2.54mm ZIP 1.50mm DIP 2.54mm SDIP 1.778mm 3 4 5 x × × × 8 9 × × × Number of Pins
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O-220F
778mm
OT-89
O-252
led diode 5mm
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68HC705
Abstract: 68HC705K1CP MC68HC05SC21 68HC705J1ACP 68HC705C8ACFN Motorola 68hc705j1acp MC68HC05SC27 XC68HC705V8 68HC705P6A MC68HC05SR3D
Text: SG165/D REV. 21 QUARTER 3,1996 68HC05 MICROCONTROLLERS All 68HC05 products have a standard operating voltage range from 3 V to 5.5 V unless noted in Comments. All 68HC05 products have a standard operating temperature range from 0 to 70C. Contact a Motorola Sales Office for availability of extended temperature versions.
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SG165/D
68HC05
MC68HC05B4
MC68HC05B6
MC68HC05B8
MC68HC05B16
16-bit:
68HC705
68HC705K1CP
MC68HC05SC21
68HC705J1ACP
68HC705C8ACFN
Motorola 68hc705j1acp
MC68HC05SC27
XC68HC705V8
68HC705P6A
MC68HC05SR3D
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Untitled
Abstract: No abstract text available
Text: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Package Outline TO-92 TO-220F SIP ZIP DIP SDIP Lead Pitch 1.27mm 1.7mm 2.54mm 2.54mm 1.50mm 2.54mm 1.778mm Number of Pins 3 x 4 x x 5 8
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O-220F
778mm
OT-89
O-252
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SC-88 package
Abstract: SOT-89
Text: Package Systems There package are classified as insertion type, surface mount type and TCP. < Number of Pins > < PKG OUTLINE > TO-92 < LEAD > SINGLE Lead Insertion Type TO-220F 3 3, 4, 5 SIP 8 ZIP 16 DIP 8, 14, 16, 18, 20, 22, 40 Dual SDIP Package 22, 24, 28, 30, 42, 56
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O-220F
O-252
OT-89
SC-88
35-mm
70-mm
SC-88 package
SOT-89
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SC-88 package
Abstract: J-Lead, plcc
Text: PACKAGE SYSTEMS There package are classified as insertion type, surface mount type and TCP. < LEAD > < PKG OUTLINE > TO-92 Single Type Lead Insertion Type Dual Type TO-220F Package 3, 4, 5 8 ZIP 16 DIP 8, 14, 16, 18, 20, 22, 40 22, 24, 28, 30, 42, 56 Single Type Flatlead
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O-220F
O-252
SC-88
OT-89
SC-88 package
J-Lead, plcc
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240K6X-A
30S1B
42S1B-A
52S1B-B
64S1B-E
124S8
135S8-F
145S8
149S8
177S8
48P4B
P/N146071
hssop
432W6
70P3S-M
10C2-C
136P6S-C
20P5A
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Untitled
Abstract: No abstract text available
Text: DIN Styles D & E Standard 41612 OUTLINE Style E 3 Rows of 16: 48 Positions .114 Max.— 2.90 -M Max. -c n \= L „ Dip Solder = 2 ,3 or 5 Mini Wire Wrap = 6 ,7 or 8 Contact Terminations .110 . 0 2IÜ .457 11.60 90.00 ±0.10 Max. Catalog Number 48S600319312 Shown
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48S600319312
32S-6003-1522-3
DN/41
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96P603307310
Abstract: D 500 4456 2 96P-6033-0731-0 64S-6033
Text: DIN Styles B & C Standard 41612 6033 Series Pin Connector OUTLINE Style B 2 Rows of 32 = 64 Positions 3.354 85.2 ' .100 2.54 1.00 •339- Max. , L 8.6 r U j .098 2.5 .039 a 1 2.54 31 X .100 2.54 .244 6.2 3.100 78.74 3.700 M a x.-94 Style Half B 2 Rows of 16 = 32 Positions
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64P603307310
48P603307310
32P603307310
30P603307310
96S603307312
64S603307312
48S603307312
32S603307312
30S603307312
DN/42
96P603307310
D 500 4456 2
96P-6033-0731-0
64S-6033
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NJU9702
Abstract: T0-220F 5 pin lead sop
Text: PACKAGE OUTLINE TABLE • PACKAGE OUTLINE TABLE Suffix 3 Pin TO-92 L *1 O T0-220F F O TO-252 DL O SOT-89 U MTP-5 F O — — — 5 Pin — 8 Pin — 9 Pin 14 Pin 16 Pin 18 Pin 20 Pin 22 Pin — — — — — — — — — — — -t — — — — —+
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T0-220F
O-252
S0T-89
100Pin
NJM78L
NJM79LSer
NJU9702.
SDMP-30)
TQ-220F
NJU9702
5 pin lead sop
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NJU9702
Abstract: T0-252 T022OF dmp 30 package T0252
Text: PACKAGE OUTLINE A TABLE PACKAGE OUTLINE TABLE Suffix 3 Pin 5 Pin — TO-92 L *1 O T0-22ÖF F O — 8 Pin — — 9 Pin - 14 Pin — 16 Pin — 18 Pin 20 Pin — 22 Pin — — — — — TO-252 DL O — — — — — — SOT-89 U O — — — — — —
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T0-22Ã
T0-252
S0T-89
100Pin
NJH78L
NJM79LSer
NJU9702.
SDMP-30)
O-220
NJU9702
T022OF
dmp 30 package
T0252
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Untitled
Abstract: No abstract text available
Text: m -JÈr A PACKAGE OUTLINE TABLE PACKAGE OUTLINE TABLE Suffix 3 Pin 5 Pin 8 Pin 9 Pin 14 Pin 16 Pin 18 Pin 20 Pin 22 Pin TO-92 L *1 O - T0-220F F O - TO-252 DL O - - - - — - — — SOT-89 U O O — - - - - — — MTP-5 F — O — - - - — — — —
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T0-220F
O-252
OT-89
100Pin
NJM78L
NJM79LSer
NJU9702.
SDHP-30)
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923884-20-I
Abstract: EDGE22 922490-16-R solder strip 922594-16-R 922490-24-I 927739-20 923881-40-R EXTRACTOR TOOLS 33970
Text: 3M Breadboards & Test Clips • A large choice of test clips including product for DIP ICs, Shrink DIPs, SOICs, PLCCs, and LCCs • Specialized clips for testing corroded or conformai coated devices • Cable assemblies for connecting to test instrumentation
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923832-BK-B
923832-BU-B
923832-GN-B
923832-RD-B
923832-WT-B
923832-YL-B
923837-BK-B
923837-GN-B
923837-RD-B
923837-WT-B
923884-20-I
EDGE22
922490-16-R
solder strip
922594-16-R
922490-24-I
927739-20
923881-40-R
EXTRACTOR TOOLS
33970
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MD96DX
Abstract: YM7109 YTM401
Text: YAMAHA'i . S í YTM4Ü1 MD96DX 9600 bps FAX MODEM LSI with HDLC OUTLINE M D96DX is a one-chip M ODEM LSI of 9600 bps, which is upper compatible with our FAX M ODEM -LSI M D96FX (YM7109) in pin assignment and software. It is also provided with H D LC function, power saving functions, simple U A RT and external clock synchro
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MD96DX
D96DX
D96FX
YM7109)
MD96DX
YM7109
YTM401
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Untitled
Abstract: No abstract text available
Text: Y A M A H A 'L S I Y T M 411B MD9624LV FAX/DATA/VOICE MODEM LSI • OUTLINE The YTM411B is a one-chip MODEM LSI applicable to both the FAX MODEM and Data MODEM and requires low power as it can be operated with a power supply in the range: 3.3 ~ 5V. The YTM411B is an upper-level chip of VAMAHA’s FAX/DATA MODEM LSI YTM403C and has
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MD9624LV
YTM411B
YTM403C
9600/7200/4800/2400/300bps
27ter,
2400/1200/600/300bps
22bis,
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NJU9702
Abstract: No abstract text available
Text: PACKAGE OUTLINE TABLE P A C K A G E OUTLINE TA BLE Suffix 3Pin 5Pin 8Pin 9Pin 14Pin - - - - - - - - o - - - o o - - - - TO -220F F SOT-89 U o o o M TP-5 F - o D /N - - SD1P L - - DM P M - - SOP G - - TO -92 D IP L*1 l6P in - - o o o o o o o o o - SIP S /L
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14Pin
16Pin
18Pin
20Pin
22Pin
O-220F
OT-89
28Pin
30Pin
40Pin
NJU9702
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AMP D-3100
Abstract: 96S-6033-0731-2 AMP D-3100 10 pin 30P60 30P603307310 96P603307310
Text: DIN Styles B & C Standard 41612 6033 Series Socket Connector OUTLINE S tyle B 2 Rows of 32 = 64 Positions 3.736 949 3.346 85 .453 ^ 11.5 i LU I LU LU LU LU / i .b d . . h I h Style Half B 2 R ow s of 16 = 32 Positions Third B 2 Rows of 10 = 20 Positions
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96S-6033-0731-2
64P603307310
48P603307310
32P603307310
30P603307310
96S603307312
64S603307312
48S603307312
32S603307312
30S603307312
AMP D-3100
96S-6033-0731-2
AMP D-3100 10 pin
30P60
30P603307310
96P603307310
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