Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
|
Original
|
|
PDF
|
BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
|
Original
|
|
PDF
|
Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
|
Original
|
|
PDF
|
PCB design for very fine pitch csp package
Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue
|
Original
|
SSYZ015A
PCB design for very fine pitch csp package
Senju
179GHH
37K-1
B12-246
Modified Coffin-Manson Equation Calculations
Senju metal solder paste
160 e7
Semicon volume 1
SSYZ015A
|
PDF
|
smd transistor mark E13
Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue
|
Original
|
SSYZ015B
smd transistor mark E13
Modified Coffin-Manson Equation Calculations
senju solder paste m10 f12
A10D10
P6K6
BGA reflow guide
Senju metal flux T5
k5m6
K793
T4V4
|
PDF
|
transistor CS4
Abstract: BGA Solder Ball 1mm D4047
Text: Issue 1.0 Sept 2001 Description The MSM64V256CB is a 16MBit Fast 3.3V SRAM available in a multichip 192 ball BGA Ball Grid Array package. The device can be organised as 256Kx64, 512Kx32 and 1Mx16. Access times of 15 and 20ns are available at Commercial or Industrial
|
Original
|
MSM64V256CB
16MBit
256Kx64,
512Kx32
1Mx16.
64V256
transistor CS4
BGA Solder Ball 1mm
D4047
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
|
Original
|
MSM81000B
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature
|
Original
|
MSM81000B
140mW
020/48D
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.
|
Original
|
FR-406.
C36000
ASTMB16-00.
C17200
ASTM-B194-01
MIL-G-45204
SAE-AMS-QQN-290.
76nge
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.
|
Original
|
CY7C1461AV33
CY7C1463AV33
CY7C1465AV33
36-Mbit
18/512K
133-MHz
100-MHz
|
PDF
|
35 x 35 PBGA, 580 100 balls
Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8
|
Original
|
C13550EJ1V0PF00
35 x 35 PBGA, 580 100 balls
Enplas drawings
HG7900
BGA Ball Crack
153pin
NEC stacked CSP 2000
PEAK TRAY bga
BGA-35
Lead Free reflow soldering profile BGA
NEC stacked CSP
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Aries BGA Adapter Socket FEATURES: • System adapter and socket combination converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. • Allows BGA device to be plugged into and removed from application mother board. • Socket accepts Aries’ BGA to PGA adapter, Data Sheet No.
|
Original
|
FR-406.
C36000
ASTMB16-00.
C17200
ASTM-B194-01
MIL-G-45204
SAE-AMS-QQN-290.
|
PDF
|
CY7C1461AV33
Abstract: CY7C1463AV33 CY7C1465AV33 K1061 u946 B897
Text: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.
|
Original
|
CY7C1461AV33
CY7C1463AV33
CY7C1465AV33
36-Mbit
18/512K
133-MHz
100-MHz
CY7C1461AV33
CY7C1463AV33
CY7C1465AV33
K1061
u946
B897
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CY7C1355C CY7C1357C 9-Mbit 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero
|
Original
|
CY7C1355C
CY7C1357C
36/512K
133-MHz
100-MHz
100-Pin
|
PDF
|
|
|
203N
Abstract: FDZ203N
Text: FDZ203N N-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ203N minimizes both PCB space This BGA MOSFET embodies a
|
Original
|
FDZ203N
FDZ203N
203N
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a
|
Original
|
FDZ204P
FDZ204P
|
PDF
|
CY37032
Abstract: CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512
Text: Ultra37000 CPLD Family 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes
|
Original
|
Ultra37000TM
1-85049-A
160-Lead
208-Lead
51-85069-B
1-85108-A
CY37032
CY37032V
CY37064
CY37064V
CY37128
CY37128V
CY37192
CY37256
CY37384
CY37512
|
PDF
|
CY7C1355C
Abstract: No abstract text available
Text: CY7C1355C CY7C1357C 9-Mbit 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero
|
Original
|
CY7C1355C
CY7C1357C
36/512K
133-MHz
100-MHz
100-Pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CY7C1355C CY7C1357C 9-Mbit 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero
|
Original
|
CY7C1355C
CY7C1357C
36/512K
133-MHz
100-MHz
100-Pin
|
PDF
|
BGA Solder Ball collapse
Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to
|
Original
|
|
PDF
|
CY7C1355B
Abstract: CY7C1357B 63a3
Text: CY7C1355B CY7C1357B 9-Mb 256K x 36/512K x 18 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles. • Can support up to 133-MHz bus operations with zero
|
Original
|
CY7C1355B
CY7C1357B
36/512K
133-MHz
117-MHz
100-MHz
CY7C1355B/CY7C1357B
CY7C1355B
CY7C1357B
63a3
|
PDF
|
CY7C1471V33-100AXI
Abstract: No abstract text available
Text: CY7C1471V33 CY7C1473V33 CY7C1475V33 PRELIMINARY 72-Mbit 2M x 36/4M x 18/1M x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.
|
Original
|
CY7C1471V33
CY7C1473V33
CY7C1475V33
72-Mbit
36/4M
18/1M
133-MHz
100-MHz
100-Pin
CY7C1471V33-100AXI
|
PDF
|
Heraeus SOLDER PASTE F645
Abstract: heraeus f816 heraeus F645 SA30C5-89M30 Heraeus paste profile SN63-90 Heraeus paste profile F645 heraeus heraeus f816 SN63-90 Heraeus pb free paste profile
Text: SLVA333 Application Report May 2009 BGA Package Component Reliability After Long-Term Storage R. Key, B. Lange, R. Madsen ABSTRACT The white paper Component Reliability After Long Term Storage Texas Instruments application report SLVA304, http://focus.ti.com/lit/wp/slva304/slva304.pdf detailed a risk analysis with
|
Original
|
SLVA333
SLVA304,
com/lit/wp/slva304/slva304
Heraeus SOLDER PASTE F645
heraeus f816
heraeus F645
SA30C5-89M30
Heraeus paste profile
SN63-90
Heraeus paste profile F645
heraeus
heraeus f816 SN63-90
Heraeus pb free paste profile
|
PDF
|
spst reed relay
Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
Text: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic
|
Original
|
CH-8197
F-91971
CZ-10400
spst reed relay
Lead Free reflow soldering profile BGA
5B31-02
78234
relay spst
reflow hot air BGA
fine BGA thermal profile
|
PDF
|
