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    7456 IC Search Results

    7456 IC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    7456 IC Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MERA-7456

    Abstract: No abstract text available
    Text: MMIC Amplifier MERA-7456+ Typical Performance Data NOTE: Use PDF Bookmarks to view DATA at required conditions or to view GRAPHS. Definitions: Input Return Loss = -S11 dB Gain(Power Gain) = S21 (dB) Reverse Isolation = -S12 (dB) Output Return Loss = -S22 (dB)


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    MERA-7456+ 25degC MERA-7456 PDF

    IC TTL 7432

    Abstract: IC 7402, 7404, 7408, 7432, 7400 ttl 74118 74189 memory ic 74138 74189 ttl memory TTL 74289 RC4458 IC 74373 ttl 74592
    Text: Test and Measurement Systems Electronic Manufacturing Services ABI Electronics Limited Dodworth Business Park Barnsley S75 3SP South Yorkshire United Kingdom Tel: +44 0 1226 207420 Fax: +44 (0)1226 207620 www.abielectronics.co.uk ChipMaster Compact Professional IC List


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    LM7808 LM7905 MAX667 MAX872 MAX874 REF02 REF03 REF05 REF43 TLE2425 IC TTL 7432 IC 7402, 7404, 7408, 7432, 7400 ttl 74118 74189 memory ic 74138 74189 ttl memory TTL 74289 RC4458 IC 74373 ttl 74592 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 AO 7456 JM M . 554 [115.67] M AX- • i i . a - *4.612 [117.1+] — I -A _L £ | - - .550 [11 9 7 ] REF TYP 000 TOP OF P C B TO BOTTOM OF OPENING B UJ II l_ L _


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    CT6B0158 PDF

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    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 C2 7456 JM - - *3.454 [ß 7.73] MAX- - n n rn n n B 55D [1197] REF TYP NOTES: O o 1. CONNECTOR MATERIALS: -H aT HOUSING: THERMOPLASTIC UL94 V -0 r>d CONTACTS/SHIELD: a SHIELD PLATING: NICKEL OR TIN


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    PR022-Q1. CT6B0019 PDF

    CI 7456

    Abstract: 44 128
    Text: DATE REV ECN APP'D. BY 2/1/06 A2 7456 JM B s o ci |— .135 [3.43] MAX T NOTES: 1. CONNECTOR MATERIALS: |— .503 [12.78] MAX -*3.536 [B9.B1]- HOUSING: .125 [3.17]±.Û1 Û [0.25] THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN


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    PR022-Q1. Z35-7512 CT660035 CI 7456 44 128 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 A1 7456 JM .448 [11.38] REF TYP B h -.135 [ i « ] 2 X T rrcD~l T + + • + + • + + + + ■ + + 1 + ■+ ■ V+- +- + - + + +- +■ ■ » + + S1 CD L NOTES: \— 1. CONNECTOR MATERIALS: .503 [1Z.78] MAX HOUSING: THERMOPLASTIC UL94


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    PR022-01. CT660193 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 C2 7456 JM - "4.354[15.67] MAX- n n n rï n n n .550 [13.97] REF TYP B 25' 14 i •sP T B Ï r - * 4 J 0 D [109.22]o -H NOTES: 1. CONNECTOR MATERIALS: HOUSING: u u u u u


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    PR022-01. T660017 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 A2 7456 JM -*2 ,3 5 4 [59.79] M AX - -*.148 [3.75] 1Z -*2.412 [61.26]- ' ' o B 000 (TOP OF PCB TO BOTTOM OF OPENING) QTTfZi : -.010 MAX RADIUS(4) SUGGESTED PANEL OPENING •*.0S3 [Z.1Z](5) NOTES: 1. CONNECTOR MATERIALS: BOTTOM SURFACE OF JACK(PC8 SURFACE)


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    PR022-Q1. CT660199 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/1/06 A2 7456 JM 12 -2 8 -1 0 A3 9110 TRM APP’D. BY 448 [11.38] B B .135 [3.43] 2 - h 503 [12.78] MAX NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


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    PR022-01. T3181 TIA-1096 CT660022 PDF

    Untitled

    Abstract: No abstract text available
    Text: .865 [21.97] MAX.- X DATE REV ECN 2/1/06 A3 7456 JM 9/20/06 A4 7746 TRM ’m ’ CM o -H o o 71 □ APP'D. BY -H o in in — .060 [1.52] 2 B B — .280 [7.11] (2) 2.150 [54.61] "0 .425 [10.80] 4 + 1 + 3 +5 +7 2+ V + 8+ -f1 + 3 + 5 + 7 2+4+6+8+ +1 + 3 + 5 + 7


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    CT660016 PDF

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/1/06 DATE A2 7456 JM 1 2 -2 8 -1 0 A3 9110 TRM APP’D. BY B B in r-» o o .135 [3.43] 2 — h .503 [12.78] MAX NOTES: [— 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY 125 [3181 + -°20 .IZD LA1ÖJ _m


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    PR022-01. TIA-1096 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV 2/1/06 ECN A2 7456 JM 2 -1 2 -0 9 A3 8660 TA APP’D. BY • 1.205 [30.61] MAX ■ i .550 [13.97] REF B B CN — 1.000 [25.40] — io ^ m 5 XI ♦ ♦ ♦ ♦ -.523 [13.28] MAX NOTES: — .125 [3.17]±.010 [0.25] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0


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    PR022-01. CT660045 PDF

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/1/06 DATE A2 7456 JM 1 0 -2 3 -0 9 A3 8851 TRM APP’D. BY .040 [1.02] 5 — -.0 28 [.71] (6) i i i i i i lO o mm i H i i i i i in o ro -.4 00 [10.16].028 [0.71] MINIMUM PCB THICKNESS .100 [2.53] ±.010 [0.25] — n .050 [1.27] (2) — -| — P.C.B. RECOMMENDED HOLE LAYOUT


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    PR022-01. CT680015 PDF

    Untitled

    Abstract: No abstract text available
    Text: 2 DATE REV. ECN A P P ' D BY 2-2-06 A2 7456 JM 7-7-06 A3 7671 TRM *{.448 [ I I .38] PORT SPA C IN G NOTES: - TOLERANCES COMPLY WITH F . C . C . D IM E N S IO N REQUIREMENTS ALL OTHERS ± . 0 0 5 [ 0 . I 3 ] UNLESS OTHERWISE SPECIFIED. - D I M E N S I O N S SHOWN W I T H


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: TKII^ IjSS Crystal Oscillator FXO-31F clock Crystal Oscillator •4# fi/Feature •t ? ; y ? H40.000 • KSS 7C ]j • > ? 7 ' f X h ' U - K<7)'h • m t T \ is s is fm • ')y a-UA,tzitli^mvto • CMOS, TTL IC L U n g -ft^ C M O S • IC ftK c D T lc JI


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    FXO-31F 50MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: - DATE REV ECN APP'D. BY 2 / 1/06 A1 74-56 JM - i m [ 2 .5 5 }t .m [0.25] ! X irt I B — - .725 [ 18.4-2 ] - •MAX NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


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    PR022-Q1. CT680007 PDF

    LSE B3

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 A2 74-56 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA [— .523 [13.2B] MAX SEE CHART FOR PART NUMBER


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    PR022-Q1. Z35-7512 CT660049 LSE B3 PDF

    CT660056

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/1/06 B2 74-56 JM s t-n B .550 [13.97] REF TYP S “W T T -*1.35D [39.37]- NOTES: 1. CONNECTOR MATERIALS: QO HOUSING: CED LT> THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: K> COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


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    PR022-Q1. Z35-7512 CT660056 CT660056 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2 / 1/06 A1 74-56 JM B û r-~ cj jL_L NOTES: 1. CONNECTOR MATERIALS: — .523 [13.28] HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: -.125 [3.17]±.ai0 [0.25] CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


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    PR022-01. Z35-7512 CT660149 PDF

    DL1020

    Abstract: TB293 m939 R04350B TB-293
    Text: THIRD ANGLE PROJECTION 4 REV ECN No. OR M93927 M102713 Â REVISIONS DESCRIPTION DATE SU G G EST ED MOUNTING CONFIGURATION D R AUTH 08/19/04 01/12/06 NEW RELEASE ADDED ".WITH SMOBC” GF GF WP IL FOR DL1020 C A S E STYLE. ”q b ” PIN CONNECTION .080 .024 TYP.


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    M93927 M102713 DL1020 R04350B 0a/ia/04 DL1020, MERA556/7456, TB-293 98PL164 98-PL-164 TB293 m939 TB-293 PDF

    micro sd connector

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2 /1 /0 6 A2 74-56 JM -*2231 [59.36] MAX- H -.448 [11.38] REF TYP B 3 i^ i - LTD O 1 O 1- 1 1-« LH LD OO |——.135 [143] 2 NOTES: 1. CONNECTOR MATERIALS: HOUSING: + H -+ + THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY


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    l17jt PR022-Q1. Z35-7512 CT660029 micro sd connector PDF

    84ir

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2 / 1/06 B2 74-56 JM s ►i .550 [13.97] REF TYP Í B § NOTES: uO 1. CONNECTOR MATERIALS: g HOUSING: I 1 THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


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    PR022-01. Z35-7512 CT660059 84ir PDF

    NT 101

    Abstract: SS-668806S-A-NF
    Text: DATE REV ECN APP'D. BY 2/1/06 C2 74-56 JM - *3.454 [â 7.73] MAX-► S r<> -.550 [13.97] TYP REF B LO *3.200 [B1.2B] o 2 S NOTES: +Í 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0


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    PR022-Q1. Z35-7512 CT660018 NT 101 SS-668806S-A-NF PDF

    jantx1n4954

    Abstract: No abstract text available
    Text: Zener Regulator Diodes Part Number 1N5338B 1N6637 SMBG5338B SMBJ5338B 1N5339A 1N5339B 1N5968 1N5968US JAN1N5968 JAN1N5968US JANTX1N5968 JANTX1N5968US JANTXV1N5968 JANTXV1N5968US SMBG5339B SMBJ5339B 1N5340A 1N5340B SMBG5340B SMBJ5340B 1N5341A 1N5341B 1N5969


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    ZEN-115 jantx1n4954 PDF