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    7457 IC Search Results

    7457 IC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    7457 IC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM - *3.4-54 [8 7.73] M AX- - C C n i n B -.550 [13.97] TYP REF 25' 10 ^ 3 um *<3.200 [81.28] NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0


    OCR Scan     		PDF PR022-01. CT710037

    2 ao 565

    Abstract: SC CONNECTOR DRAWING aesz
    Text: DATE REV ECN APP'D. BY 2/2/06 AO 7457 JM g l B ISOMETRIC VIEW NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-Q1. Z35-7512 CT710079 2 ao 565 SC CONNECTOR DRAWING aesz

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 SAW APP’D. BY .635 [16.13] MAX B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF 7188Sâ CT710065

    p085

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A3 7457 JM - -*3.454- [0 7.73] MAX- B ca — I I— .55D [1197] TYP REF NOTES: *3.200 [B1.28] 1. CONNECTOR MATERIALS: m co HOUSING: O THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD:


    OCR Scan     		PDF PR022-01. CT710017 p085

    SS-7188S-A-NF-K1-50

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF PR022-01. Z35-7512 CT710099 SS-7188S-A-NF-K1-50

    Untitled

    Abstract: No abstract text available
    Text: REV ECN 2/2 /06 DATE A3 7457 JM 3/21/06 A4 7549 TRM APP'D. BY B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT710046

    Untitled

    Abstract: No abstract text available
    Text: • BOTTOM SURFACE OF JACK PCB SURFACE *.1+8 [3.75 ] (6) DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM .004 (TOP OF PCB TO BOTTOM OF OPENING) B -.010 MAX. RADIUS(4) SUGGESTED PANEL OPENING NOTES: .051 [ 1.29] (2) — 1. CONNECTOR MATERIALS: TO HIGHEST POINT


    OCR Scan     		PDF PR022-01. T700043

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D . B Y 2/2/06 A4 7457 JM B SUGGESTED PANEL OPENING POINT O F CONTACT WITH PANEL — .146 [3.75] HIGHEST POINT OF BEAM NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN


    OCR Scan     		PDF PR022-01. CT710025

    Untitled

    Abstract: No abstract text available
    Text: - * 1 3 5 4 [5 9 .79 ] MAX DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM - B n ri n .550 [13,97] REF TYP NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN


    OCR Scan     		PDF PR022-01. CT710047

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/ 2 /06 A2 7457 JM 3/21/06 A3 7549 SAW APP'D. BY B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT710015

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF PR022-01. CT710005

    Forces

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM - - *Z35 4 [5 3.79] M AX- - I diti / '’9 i 8 «.HB [175] 12) 'i -.0/0 MAX. RADIUS(4] * 2.412 [61.26 ] - .000 (TOP OF PCB TO BOTTOM OF OPENING) B SUGGESTED PANEL OPENING |LU l l _ L _ ^


    OCR Scan     		PDF PR022-Q1. CT710074 Forces

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/2/06 A3 7457 JM 3/21/06 A4 7549 SAW APP’D. BY .635 [16.13] MAX B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF PR022-01. CT710065

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM .004 TOP OF PCB TO BOTTOM OF OPENING . B -.010 MAX RADIUS(4) SUGGESTED PANEL OPENING •BOTTOM SURFACE OF JACK (PCB SURFACE) NOTES: POINT OF CONTACT WITH PANEL 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0


    OCR Scan     		PDF PR022-01. CT700010

    CT710025

    Abstract: GL-006
    Text: -.850 [21.59] MAX.- DATE REV ECN 2/2/06 A4 7457 JM 3/21/06 A5 7549 TRM APP’D. BY .148 [3.75] • HIGHEST POINT OF BEAM i - ( .068 [1.73] ) B B — .125 ±.010 [3.18 ±0.25] .155 [3.937] TYP. ( .016 [0.41] ) ( .083 [2.12] ) — HIGHEST POINT OF BEAM H


    OCR Scan     		PDF gl006 CT710025 CT710025 GL-006

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM B S- NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-Q1.


    OCR Scan     		PDF PR022-Q1. CT700003

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM s ci B -H in o — 1 NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA - .05D [1.27] TVP TOL NON-ACCUM


    OCR Scan     		PDF PR022-01.

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 B2 7457 JM PART CENTERLINE .004 TOP OF PCB TO BOTTOM OF OPENING — *.706 [17.93] — BOTTOM SURFACE OF JACK B ;010 MAX. RADIUS(4) <N (PCB SURFACE) O -.B2G [15.90] MAX.- SUGGESTED PANEL OPENING FOR (2) IN LINE APPLICATION O


    OCR Scan     		PDF PR022-01. CT700013

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN 2/2 /06 A2 7457 JM 3/21/06 A3 7549 SAW APP’D. BY • .850 [21.59] MAX ■ B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA


    OCR Scan     		PDF CT710002

    NT 101

    Abstract: No abstract text available
    Text: .100 [2.54] 3 DATE REV ECN APP'D. BY 2/2/06 A4 7457 JM .050 [1.27] (7) .050 [1.27] 0.035 [0.B9] ±.003 [OJOS] (fi) |-$H 0.005 [g.15]| , 0.062 [K57] ±.0D3 [O.ÜB] (Z )— ' f I4I0DQG [oTTsJI .125 [11B ] -fri 0.006 [0.Î5Ï1 | B P.C.B. RECOMMENDED HOLE LAYOUT


    OCR Scan     		PDF Z35-7512 CT700020 NT 101

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM B SUGGESTED PANEL OPENING POINT OF CONTACT WITH PANEL - . 1 4 8 [3.75] HIGHEST POINT DF BEAM - .080 NOTES: 1. CONNECTOR MATERIALS: CNj O \ A C3> ÇNl LT* HOUSING: THERMOPLASTIC UL94- V - 0 CONTACTS/SHIELD: COPPER ALLOY


    OCR Scan     		PDF PR022-Q1. T710077

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A2 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF PR022-01.

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A3 7457 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.


    OCR Scan     		PDF PR022-01. CT710065

    Untitled

    Abstract: No abstract text available
    Text: DATE REV ECN APP'D. BY 2/2/06 A1 7457 JM B s f'-'í -.550 [13.97] REF NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER


    OCR Scan     		PDF PR022-01. CT710087