Untitled
Abstract: No abstract text available
Text: MT9M012: 1.6Mp CMOS Digital Image Sensor Die Features 1/4.5-Inch, 1.6Mp CMOS Digital Image Sensor Die MT9M012 For the product data sheet, refer to Aptina’s Web site: www.Aptina.com Features • • • • • • • • • • • • • • • •
|
Original
|
PDF
|
MT9M012:
MT9M012
1280H
20V/50
3518383133/Source:
MT9M012
|
Untitled
Abstract: No abstract text available
Text: MT9N011: 9Mp CMOS Digital Image Sensor Die Features 1/2.3-Inch, 9Mp CMOS Active-Pixel Digital Image Sensor Die MT9N011 For the product data sheet, refer to Aptina’s Web site: www.aptina.com Features Die Database • • • • • • • • Die outline, see Figure 5 on page 14
|
Original
|
PDF
|
MT9N011:
MT9N011
9671814848/Source:
MT9N011
|
Untitled
Abstract: No abstract text available
Text: Series 6556 Universal Test Socket Receptacle ORDERING INFORMATION XX-6556-XX No. of pins see table Plating: 0=Tin body/Gold collet 0TL=Tin/Lead body/ Gold collet 1=Gold body/Gold collet Series Pin style: 1=solder tail 2=2 level wire wrap 3=3 level wire wrap
|
Original
|
PDF
|
XX-6556-XX
|
6556
Abstract: No abstract text available
Text: Series 6556 Universal Test Socket Receptacle ORDERING INFORMATION XX-6556-XX No. of pins see table Series Pin style: 1=solder tail 2=2 level wire wrap 3=3 level wire wrap 4=solder cup No. of Pins 24 28 32 36 40 42 44 48 Dim. ”A” 1.790 [45.47] 1.990 [50.55]
|
Original
|
PDF
|
XX-6556-XX
6556
|
Untitled
Abstract: No abstract text available
Text: Series 6556 Universal Test Socket Receptacle ORDERING INFORMATION XX-6556-XX No. of pins see table Plating: 0=Tin body/Gold collet 0TL=Tin/Lead body/ Gold collet 1=Gold body/Gold collet Series Pin style: 1=solder tail 2=2 level wire wrap 3=3 level wire wrap
|
Original
|
PDF
|
XX-6556-XX
|
Untitled
Abstract: No abstract text available
Text: Series 6556 Universal Test Socket Receptacle ORDERING INFORMATION XX-6556-XX No. of pins see table Plating: 0=Tin body/Gold collet 0TL=Tin/Lead body/ Gold collet 1=Gold body/Gold collet Series Pin style: 1=solder tail 2=2 level wire wrap 3=3 level wire wrap
|
Original
|
PDF
|
XX-6556-XX
|
Untitled
Abstract: No abstract text available
Text: RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. ~ w LOC û 0.1 A ll TINE AND HOU DOWN 2 PLC ,I 0.20 0 .5 0 ± 0 .1 0 TYP. LTR DESCRIPTION REVISED ECR— 0 9 — 008541 ) DWN APVD 15APR09 JL WK PCB BOARD PPPPPl Ln 24.50 25.60 30.43 24.00 25.10 29.93
|
OCR Scan
|
PDF
|
31MAR2000
|
YP51
Abstract: ARC 2686 P5108
Text: 100 P.98C II I GICHT j o r 3| TI / . PO LA R IZ A T IO N M A R K PIN No. I c B REV. 6/5/95 DATE IAS S < ? v DR. CM. 95-0317 Annrn TG30 ano Tnr pi a t iu h Dt SCRIP MON E.C.N. T H IS ORAWI NO I 5 THE PROPERTY OF RO BIN SO N NUGENT IN C . , ANO MUST NOT BE C O P IE D OR REPRODUCED
|
OCR Scan
|
PDF
|
PAK-50
P51-XXXP
10001398C1I
YP51
ARC 2686
P5108
|
SS-7388H11S-PG4
Abstract: No abstract text available
Text: DATE REV ECN 1 -1 9 -0 6 A1 - JM 4 -1 1 -0 6 A2 7581 TRM APP’D. BY B B OF OPENING NOTES: I— .450 [11.43] — I 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY .350 [8.89] CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA
|
OCR Scan
|
PDF
|
fl006
CT730152
SS-7388H11S-PG4
|
Untitled
Abstract: No abstract text available
Text: DATE 1 -1 9 -0 6 — — I REV ECN APP’D. BY AO - JM [— *.148 [3.75] 20 I— .550 [13.97] REF TYP * • B B 1— .145 [3.68] I— .040 [1.02](9) — *.083 [2.12](9) NOTES: BOTTOM SURFACE OF JACK(PCB SURFACE) 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0
|
OCR Scan
|
PDF
|
CT710115
|
