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    8 LEADS PACKAGE Search Results

    8 LEADS PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
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    8 LEADS PACKAGE Price and Stock

    Eaton Bussmann BK/S505SC-8-R

    5mm x 20mm fuses
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com BK/S505SC-8-R 2,500
    • 1 -
    • 10 -
    • 100 $2.42
    • 1000 $2.19
    • 10000 $0.81
    		Buy Now

    Pomona Electronics EM3782-36-8#

    Test Lead - Minigrabber - Hook Clip to 4mm Banana Plug - 60 VDC - 5 A - 914.5 mm - Gray.
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com EM3782-36-8# 14
    • 1 -
    • 10 $12.98
    • 100 $8.29
    • 1000 $7.99
    • 10000 $7.99
    		Buy Now

    Eaton Bussmann S505SC-8-R

    Axial Lead Ceramic Tube Fuse
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com S505SC-8-R
    • 1 $0
    • 10 $0
    • 100 $0
    • 1000 $0
    • 10000 $0
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    8 LEADS PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MO-048

    Abstract: No abstract text available
    Text:  Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach


    Original     		MO-048 063W/cm TH17023 175x195 MO-048 PDF

    MO-048

    Abstract: MULTIWATT die TH17023
    Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach


    Original     		MO-048 063W/cm TH17023 175x195 MO-048 MULTIWATT die PDF

    MO-048

    Abstract: MULTIWATT die CMC 15 EPOXY RESIN
    Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach


    Original     		MO-048 063W/cm TH17023 175x195 MO-048 MULTIWATT die CMC 15 EPOXY RESIN PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin


    Original     		063W/cm 120x130 175x195 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin


    Original     		063W/cm 120x130 175x195 PDF

    Untitled

    Abstract: No abstract text available
    Text:  Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    SOIC-16

    Abstract: PLCC-20 SIP 9 SOIC-8 lr 014
    Text: PACKAGE DESIGNATORS A DIP 14 to 40 pins B (Semi-Tab DIP) 8 to 24 pins Dwg. OA-004-18 Dwg. OA-004-17 K (SIP) 4 pins KA (SIP) 5 pins LL, LR, or LT (SOT) Dwg. OA-014-64 L (SOIC) 8, 14, or 16 leads Dwg. OA-008-3 LB (Semi-Tab SOIC) 16 to 24 leads LW (Wide-Body SOIC) 16 to 28 leads


    Original     		OA-004-18 OA-004-17 OA-014-64 OA-008-3 OA-005-14 OA-005-21 OA-015-3 OA-007-44 OA-013-4 OA-005-17 SOIC-16 PLCC-20 SIP 9 SOIC-8 lr 014 PDF

    sot38

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines IDF16: plastic dual in-line package; 16 leads September 1994 SOT38-8 1


    Original     		IDF16: OT38-8 sot38 PDF

    A 708 transistor

    Abstract: Semiconwell
    Text: SEMICONWELL SMALL OUTLINE TRANSISTOR PACKAGE SC 70-8 Integrated Passive Networks PACKAGE OUTLINE SHORT PACKAGE DESCRIPTION SMALL OUTLINE TRANSISTOR SOT package is a rectangular surface mount transistor or diode with three or more gull wings leads. The leads are


    Original     		OT143, OT223 A 708 transistor Semiconwell PDF

    sot-96-1

    Abstract: SOT96
    Text: Philips Semiconductors Package outlines SO8: plastic small outline package; 8 leads; body width 3.9mm 1997 May 22 5 SOT96-1


    Original     		OT96-1 sot-96-1 SOT96 PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 3080 SOT97-1


    Original     		OT97-1 PDF

    SOT96- 1

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SO8: plastic small outline package; 8 leads; body width 3.9mm 1995 Feb 04 3095 SOT96-1


    Original     		OT96-1 SOT96- 1 PDF

    SOT97-1

    Abstract: SOT-97
    Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 5-4 SOT97-1


    Original     		OT97-1 SOT97-1 SOT-97 PDF

    SDIP42

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SDIP42: plastic shrink dual in-line package; 42 leads 600 mil 1995 Feb 04 5-8 SOT270-1


    Original     		SDIP42: OT270-1 SDIP42 PDF

    sot96

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SO8: plastic small outline package; 8 leads straight ; body width 3.9 mm 1997 May 22 6 SOT96-2


    Original     		OT96-2 sot96 PDF

    SEI resistor

    Abstract: No abstract text available
    Text: Thick Film Resistor Networks Single Inline Package SEI Types LC & HC • • • • • Low Profile Standard — High Profile Available 6, 8 or 10 Pins Standard — 4, 5, 7, 9, 11 or 12 Pin Available Copper Leads Standard — Steel Leads Optional Black Body Color


    Original     		100ppm/ 50ppm SEI resistor PDF

    X10-4

    Abstract: RE903
    Text: MSOP-8 8-leads molded small outline package RE903 - Epoxydglashartgewebe FR4 1,50 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseite mit einer Oberfläche aus chem. AU und <br> Lötstoppmaske - Lochdurchmesser 1,00 mm - Adaptionsplatine für 1 x MSOP-8


    Original     		RE903 X10-4 RE903 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package Outline Drawings Hermetic and Molded DIPs HD420 & PD520 Series HERMETIC NO LEADS A MOLDED B C D E F G H NO LEADS A c B D E F G H 8 LEADS 0.400 0.160 0.018 0.100 0.300 0.170 0.012 10° 8 LE A D 0.400 0.160 0.018 0.100 0.300 0.125 0.012 10° 14 LE A D S


    OCR Scan     		HD420 PD520 PDF

    PHILIPS OQ 0501

    Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
    Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body


    OCR Scan     		DIP14 DIP16 DIP18 DIP20 DIP24 DIP28 DIP40 LQFP32 PHILIPS OQ 0501 philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips PDF

    sot267

    Abstract: No abstract text available
    Text: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body


    OCR Scan     		DIP16 DIP20 DIP24 DIP28 DIP40 OT97-1 OT38-1 OT146-1 OT101-1; OT101B sot267 PDF

    lm 3090

    Abstract: HLMP-3200 XC-30211 L-285 LM 3466 HLMP-3201 HLMP-3350 HLMP-3351 HLMP-3365 HLMP-3366
    Text: Package Style Part Number • • T1J4 Low Profile .020 Sq. Leads A M ‘ ii i r Du ii u D = .1 8 5 4,70 L = .230 (5,84) T1 'A Low Profile .020 Sq. Leads r \ id Wu u Plastic Lens Type r \ fj bT 11U H D = . 190 (4,83) L = .28 5 (7,24) T1 % Flangless Low .020 Sq. Leads


    OCR Scan     		NSL5920 NSL5921 HLMP-3200 HLMP-3201 HLMP-3350 HLMP-3351 HLMP-3365 HLMP-3366 HLMP-3450 HLMP-3451 lm 3090 XC-30211 L-285 LM 3466 PDF

    Untitled

    Abstract: No abstract text available
    Text: PCI D ata Sheet Fast Or b - 50 Amp Avalanche AUTOMOTIVE RECTIFIERS Semiconductor Mechanical Dimensions Options - A dd Suffix to Part #: FR5028 F R 50 2 8 L = 2 Leads For 1 Lead Small Pkg: FR 5028C = Lead On Cathode FR 50 2 8 A = Lead On Anode Leads 1.00 typ. .05Dla.


    OCR Scan     		FR5028 5028C 05Dla. ReC10 21X21X5 48X22X36cm 21X9X8 51X25X30cm PDF