Contextual Info: 80D0M Metal seal 80pin PIGGY BACK EIAJ Package Code – JEDEC Code – Weight g 21.0±0.2 18.12TYP 14.22TYP 12.02TYP 0.8TYP 18.4±0.15 9.0MAX 0.8TYP 0.6TYP 41 64 65 0.8TYP 9.48TYP 4.5TYP 11.68TYP 15.58TYP 6.0TYP 80 0.3TYP INDEX INDEX 1.27TYP 24 1 1.2TYP 1.2TYP

21002

Abstract: 1200-15
Contextual Info: 80D0M Metal seal 80pin PIGGY BACK EIAJ Package Code – JEDEC Code – Weight g 21.0±0.2 18.12TYP 14.22TYP 12.02TYP 0.8TYP 18.4±0.15 9.0MAX 0.8TYP 0.6TYP 41 64 65 0.8TYP 9.48TYP 4.5TYP 11.68TYP 15.58TYP 6.0TYP 80 0.3TYP INDEX INDEX 1.27TYP 24 1 1.2TYP 1.2TYP

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

ic59-64075-G4

Abstract: Yamaichi IC51-0804-808 IC51-1004-809 IC51-0644-807 IC51-0242-802 IC51-0644-807 Datasheet socket Yamaichi ic51 qfp IC51-0804-808 Yamaichi Electronics IC51-1004-814-6
Contextual Info: Appendix F List of MCU Connecting Parts Made by Partners Pin-pitch mm Package form Mounting socket SSOP 0.65 20P2E-A 20P2F-A - SOP 1.27 20P2N-A - SSOP 0.8 24P2Q-A - LQFP 0.8 32P6B-A 32P6U-A - SDIP 1.778 32P4B IC83-3204-GG4 (made by Yamaichi Electronics Co., Ltd.)

M37451M8

Abstract: m5m82c55AP-2 M37451MC M60014-0120FP M37450 M37451M8-XXXGP M37451MC-XXXFP M37451SSP M37451SFP "SERIES MELPS 740"
Contextual Info: FOREWORD This user's manual describes the hardware of Mitsu­ bishi's CMOS 8 -bit microcomputer M37451 Group. After reading this manual, the user should have a thorough knowledge of the functions and features of the M37451 Group, and should be able to fully utilize these

ic59-64075-G4

Abstract: IC51-0242-802 zigzag 40pin connector IC51-0844-401-1 M32R M32170T-SDI 100P6-B Eletech Electronics f 4556 M3888 QFP 128 lead .5mm
Contextual Info: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

ic59-64075-G4

Abstract: IC51-0242-802 PC4600 ic59-64075 Eletech Electronics f 4556 IC51-0844-401-1 QFP 128 lead .5mm M32182 M32R
Contextual Info: 2004.5 Renesas Microcomputers Developer Tools Accessory Guide 2004.3 Introduction Contact To meet the needs for target systems that vary from customer to Local Renesas Technology sales office or distributor. customer, Renesas Technology Corp. provides a wide selection of

740-Family

Abstract: 9907A M37783 m37602 M37780 FLX160-PRB ic59-64075-G4 M37702E4 m37774 M37798
Contextual Info: Introduction To meet the needs for target systems that vary from customer to customer, Mitsubishi provides a wide selection of MCU packages and various types of accessories. These accessories can be used to connect the target and emulator, as well as mount an evaluation MCU on the target when its package is different from that of the actual

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension