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    Rochester Electronics LLC S82425EX

    PCI BUS CONTROLLER, MOS, PQFP208
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    DigiKey S82425EX Bulk 17
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    • 100 $18.05
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    Intel Corporation S82425EX

    PCI Bus Controller, MOS, PQFP208
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    Rochester Electronics S82425EX 46,786 1
    • 1 $17.36
    • 10 $17.36
    • 100 $16.32
    • 1000 $14.76
    • 10000 $14.76
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    Intel Corporation S82425EXSZ897

    PCI SYSTEM CONTROLLER PCI Bus Controller, MOS, PQFP208
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA S82425EXSZ897 46
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    82425EX Datasheets Context Search

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    82420EX

    Abstract: No abstract text available
    Text: in te i 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER PSC AND 82426EX ISA BRIDGE (IB) Host CPU - 2 5 - 3 3 MHz ln te l4 8 6 T M and Programmable Attribute Map for First 1 MByte of Main Memory O v e rD riv e P ro ce ss o rs 100% ISA Compatible


    OCR Scan     		82420EX 82425EX 82426EX PDF

    82425EX

    Abstract: 82426EX intel 82c59 82C59 82c42
    Text: Ä P Ä I DIM F KD!i]ÄcirO Kl in te i 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER (PSC AND 82426EX ISA BRIDGE (IB) Host CPU - 2 5 - 3 3 MHz lnte!486TM and OverDriveTM Processors — L1 Write-Back Support Programmable Attribute Map for First


    OCR Scan     		82420EX 82425EX 82426EX 486TM CLK20UT 2x82037 2x82059 IRQ12/M 1x82CS4 intel 82c59 82C59 82c42 PDF

    82426EX

    Abstract: 82420EX 82425EX
    Text: in y Ö M F K [M Ä Y O M 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER PSC AND 82426EX ISA BRIDGE (IB) • Host CPU - 2 5 - 3 3 MHz Intel486 and OverDrive™ Processors — L1 Write-Back Support ■ Programmable Attribute Map for First


    OCR Scan     		82420EX 82425EX 82426EX 27-bit 82C54 82C59 IOCS16# MEMCS16# CLK20UT 2X82C37 PDF

    82425EX

    Abstract: 82426EX 82420 82420EX t34i osa-104 AA T37B t17c tag044 82C42
    Text: 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER PSC AND 82426EX ISA BRIDGE (IB) Y Y Y Y Host CPU 25 – 33 MHz Intel486 TM and OverDrive TM Processors L1 Write-Back Support Integrated DRAM Controller 1 to 128 MByte Main Memory 70 ns Fast Page Mode DRAM SIMMs


    Original     		82420EX 82425EX 82426EX Intel486 27-bits 82420 t34i osa-104 AA T37B t17c tag044 82C42 PDF

    all ic data

    Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
    Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile


    Original     		PDF

    all ic data

    Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
    Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment PDF

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208 PDF