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    836MM Price and Stock

    3M Interconnect 898-36MMX55M

    TAPE FILAMENT CLEAR 1.42"X60YDS
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    DigiKey 898-36MMX55M Bulk 24
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    • 100 $42.18667
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    onsemi LB1836M-MPB-E

    IC HALF BRIDGE DRIVER 1A 14MFPS
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    DigiKey LB1836M-MPB-E Ammo Pack
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    3M Interconnect 2308-36MMX55M

    TAPE MASKING NATURAL 1.42"X60YDS
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    DigiKey 2308-36MMX55M Bulk 24
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    • 100 $15.04083
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    TAIYO YUDEN FSSCSR1T836MM2AR-AJ

    FILTER SAW 836.5MHZ 5SMD
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    DigiKey FSSCSR1T836MM2AR-AJ Reel 5,000
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    Avnet Americas FSSCSR1T836MM2AR-AJ Reel 5,000
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    Mouser Electronics FSSCSR1T836MM2AR-AJ
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    3M Interconnect 2308-36mmx55m

    Adhesive Tapes PN6547 36MMX55 M BLK
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    Mouser Electronics 2308-36mmx55m
    • 1 $11.69
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    • 100 $11.45
    • 1000 $10.68
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    836MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges „ Organized as 32M x 64, user configurable as 2 x


    Original     		PDF W3H32M64E-XSBX 667Mbs

    W3H64M64E

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „


    Original     		PDF W3H64M64E-XSBX 667Mbs W3H64M64E

    Untitled

    Abstract: No abstract text available
    Text: 32M x 64 DDR2 SDRAM Optimum Density and Performance in One Package W3H32M64E-XSBX* The W3H32M64E-XSBX is a member of WEDC’s high density/high preformance family of DDR2 SDRAM’s designed to support high performance processors. Product Features Benefits


    Original     		PDF W3H32M64E-XSBX* W3H32M64E-XSBX A0-12 MIF2052

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Write latency = Read latency - 1* tCK  Package:  Commercial, Industrial and Military Temperature Ranges  Organized as 32M x 64, user configurable as 2 x


    Original     		PDF W3H32M64E-XSBX

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64E-XSBX 256MB – 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA


    Original     		PDF W3H32M64E-XSBX 256MB 256MB"

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64EA-XSBX ADVANCED* 256MB – 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64EA-XSBX 256MB 256MB"

    PS-8000

    Abstract: W3H64M64E W3H32M64E-XSBX
    Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667*, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch


    Original     		PDF W3H64M64E-XSBX W3H64M64E-XSBX PS-8000 W3H64M64E W3H32M64E-XSBX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX

    designs

    Abstract: 90-FBGA W3H32M64E-XSBX White Electronic Designs
    Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX designs 90-FBGA White Electronic Designs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 Mb/s „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges „ Organized as 32M x 64, user configurable as 2 x


    Original     		PDF W3H32M64E-XSBX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „


    Original     		PDF W3H64M64E-XSBX 667Mbs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M64EA-XSBX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges „ Organized as 32M x 64, user configurable as 2 x


    Original     		PDF W3H32M64E-XSBX 667Mbs

    CEE 32

    Abstract: W3H32M64E-XSBX
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX 32M64. CEE 32

    Untitled

    Abstract: No abstract text available
    Text: W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  62% Space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  42% I/O reduction vs FBGA


    Original     		PDF W3H32M64EA-XSBX