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Text: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UDB ultra-deep-blue MADE IN GERMANY 8/99 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 IRB red - infrared MADE IN GERMANY 2,00 Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 ALL MEASUREMENTS IN mm MAX 7/03 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD SMD - 180O ANGLE HIGH POWER OUTPUT CR 50 UB ultra-blue MADE IN GERMANY 5/03 ALL MEASUREMENTS IN MM 2,00 - 0,05 1,20 0,50 Tol.: +0,20 Epoxy Bubble 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 IRC infrared MADE IN GERMANY 2,00 Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 ALL MEASUREMENTS IN mm MAX 7/03 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UDG ultra-deep-green MADE IN GERMANY 8/99 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 HR hyper red MADE IN GERMANY 2,00 Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 ALL MEASUREMENTS IN MM MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MYG mega - yellow - green MADE IN GERMANY Tol.: +0,20 Epoxy Bubble 2,00 - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 3,20 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 UY ultra - yellow MADE IN GERMANY Tol.: +0,20 Epoxy Bubble 2,00 - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 3,20 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MY mega - yellow MADE IN GERMANY Tol.: +0,20 Epoxy Bubble 2,00 - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 3,20 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 PG pure green MADE IN GERMANY ALL MEASUREMENTS IN MM Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 2,00 MAX 1/05 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 10 IRF infrared MADE IN GERMANY 2,00 Tol.: +0,20 Epoxy Bubble 3,20 - 0,05 MAX 1,20 0,50 ALL MEASUREMENTS IN mm MAX 8/03 Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UHB ultra-high-blue MADE IN GERMANY 3/05 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MHB mega - high - blue MADE IN GERMANY 2,00 3,20 Features Tol.: +0,20 Epoxy Bubble - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 5/03 MAX Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD SMD - 180° ANGLE HIGH POWER OUTPUT CR 50 UHG ultra-high-green MADE IN GERMANY 5/03 ALL MEASUREMENTS IN MM Epoxy Bubble 2,00 - 0,05 1,20 0,50 Tol.: +0,20 3,20 MAX Features Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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Text: CERAMIC CHIP SMD O SMD - 180 ANGLE HIGH POWER OUTPUT CR 50 MR mega - red MADE IN GERMANY 2,00 3,20 Features Tol.: +0,20 Epoxy Bubble - 0,05 1,20 0,50 ALL MEASUREMENTS IN MM 6/03 MAX Solid State Ceramic Chip Surface Mounting Device High power and thermal absorbtion
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TC-2707
Abstract: DP190 5589H Outgassing
Text: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2707 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.
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TC-2707
TC-2707
DP-460
225-3S-06
DP190
5589H
Outgassing
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ntc 2,0 0539
Abstract: ntc 80 0643 NTC 5,0 0539 44001RC thermistor NTC 4,7 thermistor 10 ohm
Text: 44001RC Precision Epoxy NTC Thermistor • • • • • • • • 100 ohm Resistance @ 25°C Interchangeable ±0.2°C, 0°C to 70°C, Pressed Disk Ceramic Sensor High sensitivity Thermally conductive epoxy coating 0.095″ 2.4 mm Maximum Diameter 32 AWG, 3″ (7.6 cm) long Silver plated
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44001RC
ntc 2,0 0539
ntc 80 0643
NTC 5,0 0539
thermistor NTC 4,7
thermistor 10 ohm
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NTC 100 - 11
Abstract: ntc 50 11 ntc 33 thermistor thermistor ntc 300 44003RC bp 2384
Text: 44003RC Precision Epoxy NTC Thermistor • • • • • • • • 1000 ohm Resistance @ 25°C Interchangeable ±0.2°C, 0°C to 70°C, Pressed Disk Ceramic Sensor High sensitivity Thermally conductive epoxy coating 0.095″ 2.4 mm Maximum Diameter 32 AWG, 3″ (7.6 cm) long Silver plated
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44003RC
NTC 100 - 11
ntc 50 11
ntc 33 thermistor
thermistor ntc 300
bp 2384
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311P18-07S7R6
Abstract: 44907 thermistor 44907 311P1807S7R6 Thermistor 44907 311p18 S311-P1807S7R6 44907X S311-P18-07S7R6 S311P18-07S7R6 44907
Text: 44907 GSFC Space Qualified Thermistor • • • • • • • • Fully Qualified to GSFC S311-P1807S7R6 Specification for Flight Use 10,000 ohm Resistance @ 25°C Interchangeable ±0.2°C, 0° to 70°C, Pressed Disk Ceramic Sensor High sensitivity Thermally conductive epoxy coating that
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S311-P1807S7R6
MIL-PRF-23648
S311-P18
311P18-07S7R6
44907 thermistor
44907 311P1807S7R6
Thermistor 44907
311p18
44907X
S311-P18-07S7R6
S311P18-07S7R6
44907
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S311-P1805S7R6
Abstract: 311P18-05-S 311p18 311P18-05S-7R6 GSFC 311P18-05S7R6 095804 E-595-90
Text: 44905 GSFC Space Qualified Thermistor • • • • • • • • Fully Qualified to GSFC S311-P1805S7R6 Specification for Flight Use 5000 ohm Resistance @ 25°C Interchangeable ±0.2°C, 0° to 70°C, Pressed Disk Ceramic Sensor High sensitivity Thermally conductive epoxy coating that
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S311-P18
311P18-05-S
311p18
311P18-05S-7R6
GSFC
311P18-05S7R6
095804
E-595-90
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thermistor 91 ntc
Abstract: NTC Thermistor 120 Ohm 44030RC-BP
Text: 44030RC Precision Epoxy NTC Thermistor • • • • • • • • 3000 ohm Resistance @ 25°C Interchangeable ±0.1°C, 0°C to 70°C, Pressed Disk Ceramic Sensor High sensitivity Thermally conductive epoxy coating 0.095″ 2.4 mm Maximum Diameter 32 AWG, 3″ (7.6 cm) long Silver plated
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44030RC
thermistor 91 ntc
NTC Thermistor 120 Ohm
44030RC-BP
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hp 530 motherboard circuit and solution
Abstract: 500765 IEC-297-1 hp 530 motherboard circuit Noryl GFN 2 - 701 zintec what are the dimensions of 19" rack, 3U height motherboard hp 530 hp 530 motherboard power supply solution bs476
Text: DIPLOMAT Cases An introduction to enclosures Our manufacturing facilities have long been at the forefront of technological development, and their commitment to the providing of the most fit-for-purpose products is demonstrated by the fact that we currently manufacture some of the
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IEC-297-3
Abstract: colour coding mazak ral VERO ELECTRONICS pk 55 29-1251h 10020B vero pk 100 173-202287K alocrom 1200 vero pk-100 AlMgSi0,5
Text: SUBRACK SECTION INDEX A GUIDE TO THE EMC SCREENING OF SUBRACKS . PAGE 4.02 CUSTOMISING OPTIONS . 4.03 II SUBRACK SYSTEMS KM6-I Dimensional Criteria . 4.04-4.07 Toolkit CAD Package . 4.08
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44130
Abstract: NTC Thermistor 10000 Ohm
Text: 44106 Thermistor with Teflon Sheath • • • • • • • • Teflon® Sheath for Hostile Environments 10,000 ohm Resistance @ 25°C Interchangeable ±0.2°C, 0°C to 70°C, Pressed Disk Ceramic Sensor High sensitivity Thermally conductive epoxy coating
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