985X335X150 Search Results

R/ULM850-05-TT-C0101D

Abstract: No abstract text available
Text: 5 Gbps VCSEL 850 nm 1x1/1x4/12 chip    For flip chip stud bump and wire bond Unsealed 85% r.H./85°C certified 1, 4, or 12 channel array configuration INVISIBLE LASER RADIATION AVOID BEAM EXPOSURE CLASS 3B LASER PRODUCT Preliminary ELECTRO-OPTICAL CHARACTERISTICS