13.5MHZ RFID Reader
Abstract: LT5575 LT5570 QFN 9X9 LT5579 Wideband Mixer upconverting and downconverting lw100815ku lt5538 QFN32 5X5 GND AA 14-Bit 160MSPS SAR ADC
Text: VOL 3 Wireless & RF Solutions High Performance Analog ICs Linear Technology offers some of the highest performance RF and signal chain solutions for wireless and cellular infrastructure. These products support worldwide standards LTE, WiMAX, GSM, W-CDMA, TD-SCDMA, CDMA, CDMA2000, etc. Other wireless systems
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CDMA2000,
1-800-4-LINEAR
LW100815KU
13.5MHZ RFID Reader
LT5575
LT5570
QFN 9X9
LT5579
Wideband Mixer upconverting and downconverting
lw100815ku
lt5538
QFN32 5X5 GND AA
14-Bit 160MSPS SAR ADC
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LTC66021
Abstract: LT5579 LT5570 LTC2245 QFN-48 6x6 LT6200-5 LTC22171 LT5537 LTC2602 2818D
Text: VOL 3 ワイヤレス＆RFソリューション 高性能アナログIC リニアテクノロジーはワイヤレスおよびセルラー・インフラストラクチャ向けに、最高性能 の RF およびシグナルチェーン・ソリューションを提供しています。これらの製品は、LTE、
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WiMAXGSMW-CDMATD-SCDMACDMACDMA2000
250Msps
CDMA2000
I-20041
SE-164
LTC66021
LT5579
LT5570
LTC2245
QFN-48 6x6
LT6200-5
LTC22171
LT5537
LTC2602
2818D
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RG850
Abstract: SMP2000 EM 1455 A SMP400G-BA SMP400G-BB SMP400G-BC photodiodes
Text: SMP SERIES SEME LAB Anode Passivation coating HIGH SENSITIVITY SINGLE ELEMENT SILICON PHOTODIODES Oxide layer FEATURES: N+ type Intrinsic Layer Description The SMP devices are a range of single element Silicon P.I.N. photodiodes. The device structure has be designed
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HLQFP 176 Package
Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)
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13x36
13x45
14x37
17x56
17x57
O-92L
OT-25
10x10
15x15
HLQFP 176 Package
FBGA Package 14x14
121 bga 10x10
BGA 27X27 pitch
23X23
lfbga 12X12
1.0/Daewon BGA 7x7
hssop
TQFP 14X20
TSOP 14X20
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Thin, Fine Pitch, Plastic Ball Grid Array Package TFBGA V81.5x5 D A1 CORNER B A 81 BALL THIN, FINE PITCH, PLASTIC BALL GRID ARRAY PACKAGE (TFBGA) SYMBOL MIN NOMINAL MAX NOTES A 0.75 0.91 1.07 - A1 0.15 0.21 0.27 -
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5M-1994.
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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AN1902/D
BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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Untitled
Abstract: No abstract text available
Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK64D750-70-QFP14x20-1
64PIN
AK68D1200-PLCC
AK68DS1200-PLCC
AK72D900-QFN/MLP
10X10
10MM-72
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CABGA 6x6
Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
Text: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is
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GA98111PDF2/99
CABGA 6x6
CABGA
CABGA 8X8
bga 6x8
BGA Package 14x14
CABGA 48 7x7
CABGA 56
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Untitled
Abstract: No abstract text available
Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK64D750-70-QFP14x20-1
64PIN
AK68D1200-PLCC
AK68DS1200-PLCC
AK72D900-QFN/MLP
10X10
10MM-72
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Technical Product Brief
Abstract: 88E1112 Technical Product Brief 88E1112 88E1112 sfp marvell ethernet switch sgmii alaska x register Marvell PHY 88E1112 SFP Marvell 88e1112 sgmii switch
Text: Alaska 88E1112 Technical Product Brief Integrated 10/100/1000 Gigabit Ethernet Transceiver Doc. No. MV-S105997-00, Rev. -May 9, 2011 Document Classification: Proprietary Information Marvell. Moving Forward Faster Alaska® 88E1112 Technical Product Brief
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88E1112
MV-S105997-00,
88E1112
Technical Product Brief
88E1112 Technical Product Brief
88E1112 sfp
marvell ethernet switch sgmii
alaska x register
Marvell PHY 88E1112 SFP
Marvell 88e1112
sgmii switch
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X2316
Abstract: ic27424
Text: Test Contactors IC274 Series IC274- 151 202 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads Design No. NOTE: Pogo Pin or Surface Mount available. Characteristics 1,000M½minimum at 500 VDC
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IC274
IC274-
10mA/20mV
X2316
ic27424
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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PLLP-12
Abstract: NIS5102QP1HT1G NIS51
Text: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.
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NIS5102
NIS5102/D
PLLP-12
NIS5102QP1HT1G
NIS51
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Untitled
Abstract: No abstract text available
Text: NIS5102 High Side SMART HotPlugt IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a
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NIS5102
NIS5102/D
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NIS5102
Abstract: NIS5102QP1HT1 NIS5102QP1HT1G NIS5102QP2HT1 NIS5102QP2HT1G PLLP-12 formula 9x9 0.75
Text: NIS5102 High Side SMART HotPlugt IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a
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NIS5102
NIS5102
NIS5102/D
NIS5102QP1HT1
NIS5102QP1HT1G
NIS5102QP2HT1
NIS5102QP2HT1G
PLLP-12
formula
9x9 0.75
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Untitled
Abstract: No abstract text available
Text: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.
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NIS5102
NIS5102/D
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PLLP-12
Abstract: No abstract text available
Text: NIS5102 High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a
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NIS5102
NIS5102/D
PLLP-12
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delay timer circuit diagram
Abstract: 305 power mosfet smart ups 750 circuit adjustable current limiter mosfet current mirror PLLP-12 NIS5102 NIS5102QP1HT1 NIS5102QP1HT1G NIS5102QP2HT1
Text: NIS5102 High Side SMART HotPlugt IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a
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NIS5102
NIS5102
NIS5102/D
delay timer circuit diagram
305 power mosfet
smart ups 750 circuit
adjustable current limiter
mosfet current mirror
PLLP-12
NIS5102QP1HT1
NIS5102QP1HT1G
NIS5102QP2HT1
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Untitled
Abstract: No abstract text available
Text: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.
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NIS5102
NIS5102/D
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NIS5102
Abstract: NIS5102QP1HT1 NIS5102QP1HT1G NIS5102QP2HT1 NIS5102QP2HT1G
Text: NIS5102 High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications. This chip includes a time delay for sequencing applications. It has a
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NIS5102
NIS5102
NIS5102/D
NIS5102QP1HT1
NIS5102QP1HT1G
NIS5102QP2HT1
NIS5102QP2HT1G
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Untitled
Abstract: No abstract text available
Text: NIS5102 Advance Information High Side SMART HotPlugE IC/Inrush Limiter/Circuit Breaker The NIS5102 is a controller/FET IC that saves design time and reduces the number of components required for a complete hot swap application. It is designed for +12 V applications.
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NIS5102
NIS5102/D
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Untitled
Abstract: No abstract text available
Text: IC274 Series IC274-1S1 202 • l i I I . .r .-. — C haracteristics ^ — Socket Series No. of Leads [— Insulation Resistance: Withstanding Voltage: 1,000MQminimum at 500 VDC 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial)
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IC274
IC274-1S1
000MQminimum
10mA/20mV
IC274-048126
IC274-048170
IC274-052203
IC274-060146
IC274-06447
IC274-068190
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