Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation

Contextual Info: AR/S50A – AR/S50J WTE POWER SEMICONDUCTORS Pb 50A AUTOMOTIVE BUTTON DIODE Features Diffused Junction Low Leakage Low Cost High Surge Current Capability Low Cost Construction Utilizing Void-Free Molded Plastic Technique B C Mechanical Data A Case: AR or ARS, Molded Plastic

S50Jl

Contextual Info: AR/S50AL – AR/S50JL 50A LEADED AUTOMOTIVE BUTTON DIODE WON-TOP ELECTRONICS Pb Features  Diffused Junction     Low Leakage Low Cost High Surge Current Capability Low Cost Construction Utilizing Void-Free Molded Plastic Technique D A B Mechanical Data

S-50J

Abstract: ARS50D AR50A AR50B AR50D AR50G ARS50A ARS50B S50A S50J
Contextual Info: AR/S50A – AR/S50J WTE POWER SEMICONDUCTORS Pb 50A AUTOMOTIVE BUTTON DIODE Features Diffused Junction Low Leakage Low Cost High Surge Current Capability Low Cost Construction Utilizing Void-Free Molded Plastic Technique B C Mechanical Data A Case: AR or ARS, Molded Plastic

Contextual Info: AR/S50A – AR/S50J 50A AUTOMOTIVE BUTTON DIODE WON-TOP ELECTRONICS Pb Features  Diffused Junction     Low Leakage Low Cost High Surge Current Capability Low Cost Construction Utilizing Void-Free Molded Plastic Technique B C Mechanical Data

Contextual Info: AR/S50A – AR/S50J WTE POWER SEMICONDUCTORS Pb 50A AUTOMOTIVE BUTTON DIODE Features ! Diffused Junction ! ! ! ! Low Leakage B Low Cost C High Surge Current Capability Low Cost Construction Utilizing Void-Free Molded Plastic Technique