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    BGA256 Search Results

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    BGA256 Price and Stock

    AMI Semiconductor WINA-001-PBGA256-U-XTD

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    Bristol Electronics WINA-001-PBGA256-U-XTD 598
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    AMI Semiconductor WINA/002/PBGA256R/U/XTD

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    Bristol Electronics WINA/002/PBGA256R/U/XTD 184
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    Others BGA-256(441)-1.27-04

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    Quest Components BGA-256(441)-1.27-04 18
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    BGA256 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA256 NXP Semiconductors Footprint for reflow soldering Original PDF

    BGA256 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e


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    BGA256: OT811-1 MS-034 PDF

    BGA256 17 X 17

    Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
    Text: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape


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    BGA256: OT811-1 MS-034 BGA256 17 X 17 BGA256 MS-034 BGA-256 sot811 BGA256 17 PDF

    PB-BGA256J-Z-01

    Abstract: SF-BGA256J-B-01 SF-BGA232A-B-01
    Text: U.S. PATENT 6,351,392 78.64mm [3.096"] 2.54mmtyp. [0.100"] 19.23mm [0.757"] 50.8mm [2.000"] Top View 1 * This height variable depends on the screw position. * 2 9.97mm [0.393"] 12.6mm [0.496"] 6mm [0.236"] Side View For Probing BGA256J use SF-BGA256J-B-01


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    54mmtyp. BGA256J SF-BGA256J-B-01 BGA232A SF-BGA232A-B-01 FR4/G10 16x16 PB-BGA256J-Z-01 SF-BGA256J-B-01 SF-BGA232A-B-01 PDF

    BGA256

    Abstract: sot466 BGA256 17 X 17
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1


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    BGA256: OT466-1 BGA256 sot466 BGA256 17 X 17 PDF

    P-BGA256-17x17-1

    Abstract: P-BGA-256-1 PRBG0256FB-A
    Text: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FB-A D B D1 Previous Code 256F7X-D MASS[Typ.] 0.8g A A ZD b S AB e ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Index mark S D E A A1 e


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    P-BGA256-17x17-1 PRBG0256FB-A 256F7X-D P-BGA-256-1 PRBG0256FB-A PDF

    P-BGA256-27x27-1

    Abstract: PRBG0256DA-A
    Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference


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    P-BGA256-27x27-1 PRBG0256DA-A 256F7X-A PRBG0256DA-A PDF

    BGA256

    Abstract: BGA256 17 X 17
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K


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    BGA256: OT466-1 BGA256 BGA256 17 X 17 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    BGA256 OT811-1 OT811-1 PDF

    PRBG0256DD-A

    Abstract: 2.5G P-BGA-256-2
    Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference


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    P-BGA256-27x27-1 PRBG0256DD-A 256F7X-F PRBG0256DD-A 2.5G P-BGA-256-2 PDF

    BP-256

    Abstract: P-BGA256-27x27-1 PRBG0256DE-A
    Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5


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    P-BGA256-27x27-1 PRBG0256DE-A BP-256 BP-256 PRBG0256DE-A PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x


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    BGA256: OT471-1 MS-034 PDF

    D 2395

    Abstract: BGA256 17 X 17 BGA256 MS-034
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L


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    BGA256: OT471-1 MS-034 D 2395 BGA256 17 X 17 BGA256 MS-034 PDF

    sm 0038

    Abstract: SF-BGA256B-B-11
    Text: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


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    BGA256B FR4/G10 SF-BGA256B-B-11 sm 0038 PDF

    BGA256

    Abstract: P-BGA-256-2
    Text: P-BGA256-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


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    P-BGA256-2727-1 BGA256 P-BGA-256-2 PDF

    16x16 bga

    Abstract: 16X16 SF-BGA256G-B-11
    Text: C Package Code: BGA256G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


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    BGA256G FR4/G10 16X16 SF-BGA256G-B-11 16x16 bga 16X16 PDF

    BGA256

    Abstract: No abstract text available
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K


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    BGA256: OT471-1 BGA256 PDF

    SF-BGA256C-B-11

    Abstract: BGA 23 x 23 array
    Text: D C Package Code: BGA256C See BGA pattern code to the right for actual pattern layout Y 27.94mm [1.100"] 0.64mm [0.025"] 0.89mm [0.035"] X Top View reference only 27.94mm [1.100"] 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original
    BGA256C FR4/G10 SF-BGA256C-B-11 BGA 23 x 23 array PDF

    Untitled

    Abstract: No abstract text available
    Text: P-BGA256-2727-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 2.22 TYP. 2/Oct. 28, 1996


    Original
    P-BGA256-2727-1 PDF

    P-BGA256-17x17-1

    Abstract: 17X17 PRBG0256FA-A
    Text: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FA-A D B D1 Previous Code 256F7X-C MASS[Typ.] 0.7g A b A S AB ZD e y S Index mark S ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 D E A A1 e


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    P-BGA256-17x17-1 PRBG0256FA-A 256F7X-C 17X17 PRBG0256FA-A PDF

    SF-BGA256A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA256A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


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    BGA256A FR4/G10 SF-BGA256A-B-11 PDF

    16x16 bga

    Abstract: 16X16 SF-BGA256E-B-11
    Text: C Package Code: BGA256E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]


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    BGA256E FR4/G10 16X16 SF-BGA256E-B-11 16x16 bga 16X16 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT471-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original
    BGA256 OT471-1 OT471-1 PDF

    sot471

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1


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    BGA256: OT471-1 sot471 PDF

    BGA256

    Abstract: No abstract text available
    Text: P-BGA256-1717-1.00AZ Uniti nn Jul.2003


    OCR Scan
    P-BGA256-1717-1 BGA256 PDF