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    Fischer Elektronik GmbH & Co KG ICK-BGA-40-X-40

    Heatsink for BGAs
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    DigiKey ICK-BGA-40-X-40 Bulk 17
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    Fischer Elektronik GmbH & Co KG ICK-BGA-40-X-40-X-10

    Heatsink for BGAs
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    DigiKey ICK-BGA-40-X-40-X-10 Bulk 16
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    Fischer Elektronik GmbH & Co KG ICK BGA 40 X 40 X 10

    Heat Sink; Thermal Resistance:13.8°C/W; Packages Cooled:Bga; External Width - Metric:40Mm; External Height - Metric:10.01Mm; External Length - Metric:40Mm; External Diameter - Metric:-; Heat Sink Material:Aluminum; Product Range:- Rohs Compliant: Yes |Fischer Elektronik ICK BGA 40 X 40 X 10
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    Newark ICK BGA 40 X 40 X 10 Bulk 139 1
    • 1 $1.93
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    TME ICK BGA 40 X 40 X 10 40 1
    • 1 $1.98
    • 10 $1.78
    • 100 $1.39
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    Thomas & Betts BGA400-6-40

    4In Grnd Bush 6-4/0Wire Range Al |Abb Thomas & Betts BGA400-6-40
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    Newark BGA400-6-40 Bulk 1
    • 1 $199.12
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    Onlinecomponents.com BGA400-6-40
    • 1 $139.4
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    Master Electronics BGA400-6-40
    • 1 $139.4
    • 10 $123.47
    • 100 $114.87
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    Thomas & Betts BGA400-14-20

    4In Grnd Bush 14-2/0Wire Range Al |Abb Thomas & Betts BGA400-14-20
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    Newark BGA400-14-20 Bulk 1
    • 1 $199.12
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    Onlinecomponents.com BGA400-14-20
    • 1 $139.4
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    • 100 $114.87
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    Master Electronics BGA400-14-20
    • 1 $139.4
    • 10 $123.47
    • 100 $114.87
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    BGA40 Datasheets (1)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    BGA-403-403 Metcal Soldering, Desoldering, Rework Tips, Nozzles, Soldering, Desoldering, Rework Products, NOZZLE BGA 40.3MM X 40.3MM Original PDF

    BGA40 Datasheets Context Search

    Catalog Datasheet
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    PDF

    nec 2565

    Abstract: 2565 nec JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7045-1 1521-PIN BGA40 BGA-404 4015 899-pin
    Text: TRAY CONTAINER UNIT : mm 3x7=21 NEC 40.15 135°C MAX 7 A' 25.65 42.30 84.6 BGA40×40A 135.9 PPE A 40.15 42.30 30.60 253.8 315.0 322.6 SECTION A – A' (3.91) (6.35) 7.62 40.15 Applied Package Quantity (pcs) 899-pin Plastic BGA (40×40) (FLIP CHIP TYPE)


    Original     		BGA40 899-pin 1521-pin SSD-A-H7045-1 nec 2565 2565 nec JEDEC tray standard JEDEC TRAY DIMENSIONS SSD-A-H7045-1 BGA-404 4015 PDF

    pitch 0.4mm BGA

    Abstract: SF-BGA400A-B-11 0.4mm pitch BGA
    Text: C Package Code: BGA400A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]


    Original     		BGA400A FR4/G10 20X20 SF-BGA400A-B-11 pitch 0.4mm BGA 0.4mm pitch BGA PDF

    FR4 substrate with 0.762mm thickness

    Abstract: BGA400F SF-BGA400F-B-11
    Text: D Package Code: BGA400F C 0.635mm See BGA pattern code to the right for actual pattern layout Y 0.762mm 0.025" dia. pad X 24.13mm Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)


    Original     		BGA400F 635mm 762mm FR4/G10 SF-BGA400F-B-11 FR4 substrate with 0.762mm thickness BGA400F PDF

    SF-BGA400B-B-11

    Abstract: BGA-400 BGA400
    Text: D Package Code: BGA400B 25.4mm C 24.13mm [0.950"] Ø 0.40mm [Ø 0.0156"] tooling hole x2 optional See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 1.27mm typ. [0.050"] X Top View (reference only) 0.64mm [0.025"] typ. 2 0.36mm [0.014"] dia.


    Original     		BGA400B FR4/G10 SF-BGA400B-B-11 BGA-400 BGA400 PDF

    SF-BGA408A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA408A C 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad 31.75mm X Top View reference only 1.27mm [0.050"] 0.635mm 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] .0225" dia. tooling holes (X2)


    Original     		BGA408A 624mm 878mm 635mm FR4/G10 882mm 26X26 SF-BGA408A-B-11 PDF

    IBM powerpc 405gp

    Abstract: 405GP LA-BGA-405GP-S-B-01 TLA700
    Text: Top View LA-BGA405GP-S-B-01 Drawing 1.5114" [38.391mm] 0.2163" [5.494mm] 3.3858" [86.000mm] Side View 1 0.6997" [17.772mm] Fully Plugged 2 1 2 3 3 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.


    Original     		LA-BGA405GP-S-B-01 391mm] 494mm] 000mm] 772mm] FR4/G10 finish10µ TLA700 405GP IBM powerpc 405gp LA-BGA-405GP-S-B-01 PDF

    SF-BGA400E-B-11

    Abstract: BGA-400
    Text: D Package Code: BGA400E C 28.52mm [1.123"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 28.52mm [1.123"] X Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 1.5mm [0.059"] Ø 0.64mm pad [Ø 0.025"]


    Original     		BGA400E FR4/G10 SF-BGA400E-B-11 BGA-400 PDF

    SF-BGA400D-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA400D C 30.48mm [1.200"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 30.48mm [1.200"] X 1.27mm typ. [0.050"] Top View reference only 2 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA400D FR4/G10 25X25 SF-BGA400D-B-11 PDF

    BGA400

    Abstract: No abstract text available
    Text: Package outline BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J 1/2 e H G F E D C B A shape optional 4x


    Original     		BGA400: OT901-1 MS-034 BGA400 PDF

    BGA400

    Abstract: MO-034 sot901 BGA-400
    Text: Package outline Philips Semiconductors BGA400: plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm D SOT901-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y Y W e V U T R P N M L e2 K J 1/2 e H G


    Original     		BGA400: OT901-1 MO-034 BGA400 MO-034 sot901 BGA-400 PDF

    Lead Free reflow soldering profile BGA

    Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
    Text: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109


    Original     		8833he 485mm) 241mm) Lead Free reflow soldering profile BGA BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework PDF

    SAMSUNG MCP

    Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
    Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)


    Original     		KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor PDF

    Untitled

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX PDF

    mt 1389 de

    Abstract: MLC 8050 Transistor mlc 8050 IC01 -P10 Replace philips tea 1090 8*8 led dot MATRIX Driver i2c tea 1601 t MDT 1692 LT 542 seven segment display data sheet mt 1389
    Text: REJ09B0360-0100 32 SH7764 Group Hardware Manual Renesas 32-Bit RISC Microcomputer SuperHTM RISC Engine Family SH-4A Series SH77641 SH77640 Rev.1.00 Revision Date: Nov. 22, 2007 R5S77641 R5S77640 Rev. 1.00 Nov. 22, 2007 Page ii of lvi Notes regarding these materials


    Original     		REJ09B0360-0100 SH7764 32-Bit SH77641 SH77640 R5S77641 R5S77640 mt 1389 de MLC 8050 Transistor mlc 8050 IC01 -P10 Replace philips tea 1090 8*8 led dot MATRIX Driver i2c tea 1601 t MDT 1692 LT 542 seven segment display data sheet mt 1389 PDF

    GEMINAX-L2

    Abstract: adsl2
    Text: Product Brief Lantiq GEMINAX™ XXS V3 Ultra-small, low-power, high-density ADSL2+ chipset for broadband linecard applications Applications • Multi-standard ADSL2+ DSLAM, DLC, MSAN linecards for Central Office and MDU applications Features • Supported Standards


    Original     		TS101388 PB-e-0042-v2 GEMINAX-L2 adsl2 PDF

    Manchester CODING DECODING FPGA

    Abstract: iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz


    Original     		ARM926EJ-STM 6270AS 10-Jan-08 Manchester CODING DECODING FPGA iso7816 sim 8x 8 led dot matrix AC97 ARM926EJ-S ISO7816 PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    BA100 diode

    Abstract: BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode
    Text: KADxx0300B - Txxx MCP MEMORY Document Title Multi-Chip Package MEMORY 128M Bit Two Dual Bank 64M Bit NOR Flash Memory / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark August 9, 2002 Preliminary 0.0 Initial Draft 0.1 Revised (UtRAM)


    Original     		KADxx0300B 2Mx16) 69-Ball 10MAX BA100 diode BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode PDF

    SMR 40000c

    Abstract: MMC760 la 4763 AT91CAP7 AT91CAP9 AT24LC toshiba NAND Flash memory controller ecc 6264B k 2996 4b1 toshiba
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz


    Original     		ARM926EJ-STM 6264B 26-Nov-07 SMR 40000c MMC760 la 4763 AT91CAP7 AT91CAP9 AT24LC toshiba NAND Flash memory controller ecc k 2996 4b1 toshiba PDF

    atmel part marking c16

    Abstract: AC97 ARM926EJ-S AT91CAP9S250A AT91CAP9S500A ISO7816 Manchester CODING DECODING FPGA
    Text: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer – 220 MIPS at 200 MHz


    Original     		ARM926EJ-STM 6264CS 24-Mar-09 atmel part marking c16 AC97 ARM926EJ-S AT91CAP9S250A AT91CAP9S500A ISO7816 Manchester CODING DECODING FPGA PDF

    BA107

    Abstract: ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA107 ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941 PDF

    TB 1226 BN

    Abstract: TB GUA 5365 MATERIAL TB GUA 5365 MATERIAL NEOPRENE E-23018 tb 1229 bn sj 2258 emp 5523 ASTM A123 galvanized iron thermal conductivity UL514
    Text: 412031.A01 FIT 3/12 3/20/03 3:02 PM Page 1 A Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A2 Tables and Specifications . . . . . . . . . . . . . . . . . . . . . . A3 Rigid Metal Conduit/Intermediate Metal Conduit Fittings . . . . . . . . . . . . . . . . . . . A4-A38


    Original     		A4-A38 A39-A40 A41-A49 A50-A51 A52-A53 A54-A56 A57-A65 TB 1226 BN TB GUA 5365 MATERIAL TB GUA 5365 MATERIAL NEOPRENE E-23018 tb 1229 bn sj 2258 emp 5523 ASTM A123 galvanized iron thermal conductivity UL514 PDF

    schematic diagram of laptop motherboard

    Abstract: Motherboard Intel fw82443bx siemens s35 lcd K38 SOT-23 fw82443bx USER GUIDE FW82443BX MOTHERBOARD FW82371EB pci set laptop Lithium-ion battery diagram schematic marking W26 sot23 AM2 Siemens
    Text: Intel 440BX Scalable Performance Board Development Kit Manual April 2001 Order Number: 273318-006 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		440BX PGA370 Index-106 schematic diagram of laptop motherboard Motherboard Intel fw82443bx siemens s35 lcd K38 SOT-23 fw82443bx USER GUIDE FW82443BX MOTHERBOARD FW82371EB pci set laptop Lithium-ion battery diagram schematic marking W26 sot23 AM2 Siemens PDF

    FW82371EB pci set

    Abstract: LTC1117 panasonic resistors marking code for EXB38V220JV laptop a60 power on sequence circuit diagram ferrite k37 k38 k40 MURATA BLM41P750S LTC1117CST schematic diagram of laptop motherboard EXB38V220JV fdc37b787
    Text: Pentium III Processor – Low-Power Module at 500 MHz Development Kit Manual August 2001 Order Number: 273303-005 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		Index-97 FW82371EB pci set LTC1117 panasonic resistors marking code for EXB38V220JV laptop a60 power on sequence circuit diagram ferrite k37 k38 k40 MURATA BLM41P750S LTC1117CST schematic diagram of laptop motherboard EXB38V220JV fdc37b787 PDF