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    CHA5012 Search Results

    CHA5012 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CHA5012 United Monolithic Semiconductors X Band Driver Amplifier Original PDF

    CHA5012 Datasheets Context Search

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    CHA5012

    Abstract: No abstract text available
    Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description Main Features The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through


    Original
    PDF CHA5012 CHA5012 DSCHA50126066

    CHA5012

    Abstract: No abstract text available
    Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including via holes through the substrate and air bridges. A nitride


    Original
    PDF CHA5012 CHA5012 DSCHA50120179

    Untitled

    Abstract: No abstract text available
    Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including via holes through the substrate and air bridges. A nitride


    Original
    PDF CHA5012 CHA5012 DSCHA50120179

    CHA5012

    Abstract: No abstract text available
    Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through


    Original
    PDF CHA5012 CHA5012 DSCHA50126286

    99-F

    Abstract: CHA5012-99F CHA5012
    Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through


    Original
    PDF CHA5012 CHA5012 DSCHA50126286 99-F CHA5012-99F

    PPH25X

    Abstract: No abstract text available
    Text: Contents Products . 3 Foundry open processes. 12 GaN current packaging solutions and demo boards. 14


    Original
    PDF