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    Automation Components Inc A-CP-D-6--4X

    10,000 Ohm Thermistor (Type II),
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    DigiKey A-CP-D-6--4X Ammo Pack 1
    • 1 $74
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    Automation Components Inc A-0.1CP-D-6--4X

    High Accuracy 10,000 Ohm Thermis
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A-0.1CP-D-6--4X Ammo Pack 1
    • 1 $86
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    CPD64 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CPD64 Central Semiconductor Chip Form: LOW LEAKAGE SWITCHING DIODE Original PDF

    CPD64 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CPD64

    Abstract: 1N3595 1n457a equivalent
    Text: PCN # 110 Notification Date: 21 April 2009 mailto:processchange@centralsemi.com http://www.centralsemi.com/processchange Process Change Notice Parts Affected: Chip process CPD64, Low Leakage Diode discrete semiconductors, wafers, and die in chip form. Extent of Change:


    Original     		PDF CPD64, CPD64-CLL459A-CT CPD64-CMPD3003-CT CPD64-CMPD3003-WN CPD64-1N3595-CT CPD64-1N3595-WN CPD64-1N3595-WR CPD64-1N457A-CT CPD64-1N485B-CT CMDD3003 CPD64 1N3595 1n457a equivalent

    1N3595

    Abstract: CMPD3003 CPD64
    Text: PROCESS CPD64 Central Low Leakage Diode TM Semiconductor Corp. Low Leakage Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.5 x 17.5 MILS Die Thickness 8.0 MILS Anode Bonding Pad Area 8.0 MILS DIAMETER Top Side Metalization Al - 30,000Å Back Side Metalization


    Original     		PDF CPD64 CMPD3003 1N3595 CPD64ductor 1N3595 CMPD3003 CPD64

    1N3595

    Abstract: CMPD3003 CPD64
    Text: PROCESS Central CPD64 Low Leakage Diode TM Semiconductor Corp. Low Leakage Diode Chip PROCESS DETAILS PROCESS EPITAXIAL PLANAR DIE SIZE DIE THICKNESS 17.5 x 17.5 MILS ANODE BONDING PAD AREA TOP SIDE METALIZATION 8.0 MILS DIAMETER BACK SIDE METALIZATION Au - 6,000Å


    Original     		PDF CPD64 CMPD3003 1N3595 1N3595 CMPD3003 CPD64

    1N3595

    Abstract: CMPD3003 CPD64
    Text: PROCESS CPD64 Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.5 x 17.5 MILS Die Thickness 8.0 MILS Anode Bonding Pad Area 8.0 MILS DIAMETER Top Side Metalization Al - 15,000Å Back Side Metalization Au-As - 13,000Å


    Original     		PDF CPD64 CMPD3003 1N3595 22-March 1N3595 CMPD3003 CPD64

    BF244 datasheet

    Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
    Text: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216


    Original     		PDF 1N456 CPD64 1N456A. 1N457 1N457A. 1N458 BF244 datasheet 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910

    1N3595

    Abstract: CMPD3003 CPD64
    Text: PROCESS CPD64 Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.5 x 17.5 MILS Die Thickness 8.0 MILS Anode Bonding Pad Area 8.0 MILS DIAMETER Top Side Metalization Al - 30,000Å Back Side Metalization Au - 6,000Å


    Original     		PDF CPD64 CMPD3003 1N3595 25-August 1N3595 CMPD3003 CPD64

    1N3595

    Abstract: CMPD3003 CPD64
    Text: PROCESS CPD64 Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.5 x 17.5 MILS Die Thickness 8.0 MILS Anode Bonding Pad Area 8.0 MILS DIAMETER Top Side Metalization Al - 30,000Å Back Side Metalization Au - 6,000Å


    Original     		PDF CPD64 CMPD3003 1N3595 1N3595 CMPD3003 CPD64

    358 ez 808

    Abstract: G9141 MIL-C-24308 d-sub connectors Molex Micro SAS 393 EZ 639 JWT Connector RJ45 panel mount ZZL-4016-36LD 51psb micro sata connector
    Text: ND3% BASE1 XXXX5216-0809-1-P 809 TSQ: 3001 CMS: CMS-USM TS host OP: NN COMP: 18-07-11 Hour: 16:58 TS:TS date TS time CONNECTORS & ACCESSORIES Find the Newest Technologies Online FLAT/FLEX RIBBON CABLE CONNECTORS PAK20 2mm WIREMOUNT SOCKETS 0.100 x 0.100″ THREE-WALL


    Original     		PDF PAK20 152210-0100-GB 152212-0100-GB 152220-0100-GB 152226-0100-GB 152240-0100-GB 25C7411 54H5165 14N5254 54H5156 358 ez 808 G9141 MIL-C-24308 d-sub connectors Molex Micro SAS 393 EZ 639 JWT Connector RJ45 panel mount ZZL-4016-36LD 51psb micro sata connector

    UJT 2n3904

    Abstract: transistor 2N4033 ujt 2N6027 2n4209 datasheet mj15003 equivalent transistor 2N5401 mj15004 2N4393 MJ15003 MJ15004 BAV45
    Text: Selection Guide Page Small Signal Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Bipolar Power Transistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Programmable UJT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24


    Original     		PDF

    GI code marking for diode

    Abstract: MARKING LF SOT23 LF SOT23 MARKING CODE marking code GI marking Ja diode marking code NA sot23 fr marking code
    Text: Central CMPD3003 CMPD3003A CMPD3003C CMPD3003S Sem iconductor Corp. SURFACE MOUNT LOW LEAKAGE SILICON SWITCHING DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD3003 series types are silicon switching diodes manufactured by the epitaxial planar process,


    OCR Scan     		PDF CMPD3003 CMPD3003A CMPD3003C CMPD3003S OT-23 GI code marking for diode MARKING LF SOT23 LF SOT23 MARKING CODE marking code GI marking Ja diode marking code NA sot23 fr marking code

    silicon diode

    Abstract: SOD-80 Marking Code
    Text: Central" CLL3595 Semiconductor Corp. SURFACE MOUNT LOW LEAKAGE SILICON DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CLL3595 type is an epitaxial planar silicon diode, manufac­ tured in a hermetically sealed glass surface mount package, designed for low leakage, high


    OCR Scan     		PDF CLL3595 OD-80 225lp 100mA 200mA CPD64 13-November silicon diode SOD-80 Marking Code

    SOD-80 Marking Code

    Abstract: No abstract text available
    Text: Central" CLL457A CLL459A Semiconductor Corp. SURFACE MOUNT LOW LEAKAGE SILICON DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CLL457A, CLL459A types are silicon planar diodes, manu­ factured in a hermetically sealed glass surface mount package, designed for low leakage appli­


    OCR Scan     		PDF CLL457A CLL459A CLL457A, OD-80 LL459A 100mA SOD-80 Marking Code

    MARKING CODE diode sod123 FS

    Abstract: No abstract text available
    Text: Central CMHD3595 TM Semiconductor Corp. LOW LEAKAGE SILICON DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CMHD3595 is a Silicon Diode, manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for high conductance application s req uiring low leakage.


    OCR Scan     		PDF CMHD3595 OD-123 31-October CPD64 OD-123 MARKING CODE diode sod123 FS

    BV 202 0154

    Abstract: No abstract text available
    Text: Central” CMHD3595 Semiconductor Corp. LOW LEAKAGE SILICON DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CMHD3595 is a Silicon Diode, manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for high conductance applica­


    OCR Scan     		PDF CMHD3595 OD-123 CPD64, 31-October OD-123 BV 202 0154