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Abstract: No abstract text available
Text: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 High Inrush Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &
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CQ06PT
55mmx
63VDC
63VAC.
CQ06PT
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CQ06PT
Abstract: CQ06PT004
Text: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 Slow Blow Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &
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Original
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PDF
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CQ06PT
55mmx
63VDC
63VAC.
CQ06PT
CQ06PT004
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