76494
Abstract: EME-6300H 80973 Q393
Text: Qualification Report April ,1993, QTP #91481 Version 1.0 BiCMOS CACHE TAG SRAMS MARKETING PART NUMBER DEVICE DESCRIPTION CY7B180 4K x 18 Cache Tag CY7B181 4K x 18 Cache Tag PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part
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CY7B180
CY7B181
CY7B180/181
7B180A/7B181A
Dec/1992
N0/45
15psig)
CY7B180/1
76494
EME-6300H
80973
Q393
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CY62256LL-PC
Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
Text: Cypress Semiconductor Product Reliability 1997 Published June, 1997 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM. 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY. 2
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PALCE22V10-JC
FLASH-FL22D
CY62256LL-PC
VIC068A-GC
VIC64-NC
VIC64-UMB
PALCE22V10-JI
PALC16L8Q
PLD VME
A113
CY7B923
JESD22-A113
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CY27S03A
Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability
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CY7C122
CY27S03A
15JC10
CY7C190
cy7c9101
cy7c122 die
VIC068A user guide
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Untitled
Abstract: No abstract text available
Text: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP
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7C185FT
7B181
CY7B180/181)
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EME 6300HR
Abstract: EME-6300
Text: Qualification Report September 1993, Version 1.3, QTP# 93251 ASAT ASSEMBLY QUALIFICATION 80 Lead Quad Plastic Quad Flatpack PQFP (Dry packing) CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Mold Compound Name/Manufacturer: Lead Frame material:
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EME-6300HR
7B181
CY7B180/181)
EME 6300HR
EME-6300
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CY7C9101
Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Text: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the
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Gunn Diode symbol
Abstract: cy202 CY7C190 WSP-109BMP3 pal22V10D cy7b166 cy7c291 CY7C371 EV film cap calculation gunn diode datasheet
Text: CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY APPENDIX A: FAILURE RATE CALCULATION Thermal Acceleration Factors Acceleration factors AF for thermal stresses (High Temperature Operating Life, Data Retention and High Temperature Steady State Life) are calculated from the Arrhenius equation.
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62x10-5
Gunn Diode symbol
cy202
CY7C190
WSP-109BMP3
pal22V10D
cy7b166
cy7c291
CY7C371
EV film cap calculation
gunn diode datasheet
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Untitled
Abstract: No abstract text available
Text: CY7B180 CY7B181 s CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • Can be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors Functional Description T he CY7B180 and CY7B181 are high-perform ance B iC M O S cache tag R A M s orga
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CY7B180
CY7B181
66-MHz
CY7B180
CY7B181
16-bit
7B180
CY7B181.
15LMB
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Untitled
Abstract: No abstract text available
Text: CY7B180 CY7B181 PRELIMINARY CYPRESS SEMICONDUCTOR Features 4K x 18 Cache Tag • Can be used as 4K x 18 SRAM Functional Description Supports 50-MHz cache for all major high-speed processors 4K x 18 tag organization BiCMOS for optimum speed/power High speed
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CY7B180
CY7B181
50-MHz
12-ns
15-ns
CY7B180)
CY7B181)
CY7B181â
CY7B180â
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Untitled
Abstract: No abstract text available
Text: CY7B180 CY7B181 I CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • C an be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors • 4K x 18 tag organization • BiCMOS for optimum speed/power • High speed — 10-ns match delay
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CY7B180
CY7B181
66-MHz
10-ns
13-ns
CY7B180)
CY7B181)
CY7B180â
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ue09
Abstract: CY7B180-12GC cd 2313 UE 09
Text: CY7B180 CY7B181 AD VAN C ED IN F O R M A T IO N CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features Functional Description • 4K x 18 tag organization T h e CY7B180 and CY7B181 are high-perform ance B iCM O S cache tag R A M s orga nized as 40% words by 18 bits. Each word
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CY7B180
CY7B181
12-ns
15-ns
7B180)
7B181)
ue09
CY7B180-12GC
cd 2313
UE 09
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CY7B180-12JC
Abstract: CY7B181
Text: CY7B180 CY7B181 ' r CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • Can be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors • 4K x 18 tag organization • BiCMOS for optimum speed/power • High speed — 10-ns match delay
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CY7B180
CY7B181
66-MHz
10-ns
13-ns
CY7B180)
CY7B181)
68-Square
CY7B181--10JC
CY7B181-10NC
CY7B180-12JC
CY7B181
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CY7C169
Abstract: 54600
Text: Thermal Management CYPRESS Part Number CY7B173 CY7B174 CY7B180 CY7B181 CY7B185 CY7B186 CY7B191 CY7B192 CY7B194 CY7C122 CY7C123 CY7C128 CY7C128A CY7C130 CY7C131 CY7C132 CY7C136 CY7C140 CY7C141 CY7C142 CY7C146 CY7C147 CY7C148 CY7C149 CY7C150 CY7C157 CY7C161A
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CY7B173
CY7B174
CY7B180
CY7B181
CY7B185
CY7B186
CY7B191
CY7B192
CY7B194
CY7C122
CY7C169
54600
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HESE12
Abstract: cd3510
Text: PRELIM INARY r^ Y p p p C Q - 4K x 18 Cache Tag SEMICONDUCTOR Features • Can be used as 4K x 18 SRAM • Supports 50*MHz cache for all major h ig h sp eed processors F unctional D escription • 4 K x 18 tag organization • BiCMOS for optimum speed/power
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CY7B180
CY7B181
15-ns
CY7B180)
CY7B181)
CY7B181
--12LC
181-12Y
--15GC
HESE12
cd3510
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