CL480
Abstract: No abstract text available
Text: 576 Megabit CMOS DRAM DPD16MS36PW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD16MS36PW5 is the 16 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface
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DPD16MS36PW5
DPD16MS36PW5
72-pin
30A152-00
CL480
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Untitled
Abstract: No abstract text available
Text: 640 Megabit CMOS DRAM DPD16MS40PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD16MS40PKW5 is the 16 Meg x 40 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of 12 stacks, 4 consisting of four 16
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DPD16MS40PKW5
DPD16MS40PKW5
72-pin
30A153-00
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Untitled
Abstract: No abstract text available
Text: 512 Megabit CMOS DRAM DPD16MS32PW5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS32PW5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface
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DPD16MS32PW5
DPD16MS32PW5
72-pin
30A146-00
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Untitled
Abstract: No abstract text available
Text: PENSE-PAC 64 Megabit CM OS DRAM DPD16MX4PY5 VI i C R 0 S Y S i H M S D E S C R IP T IO N : The DPD16MX4PY5 is the 16 Megx 4 Dynamic RAM module that utilize the new and innovative space savingTSOP stacking technology. The module is constructed of four 16 Meg x 1
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DPD16MX4PY5
DPD16MX4PY5
OA149-04
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 64 Megabit C M O S D R A M DPD16MX4PKY5 PRELIMINARY D E S C R IP T IO N : The DPD16M X4PKY5 is the 16 M eg x 4 Dynamic R A M module that utilize the new and innovative space saving 300m il T S O P stacking technology. The module is constructed of four 16 Meg x 1 Dynamic RAM's.
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DPD16M
DPD16MX4PKY5
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D032
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 640 Megabit C M O S D R A M DPD16MS40PKW5 PRELIMINARY D E S C R IP T IO N : The D PD 16M S40PKW 5 is the 16 Meg x 40 Dynamic R A M module in the family of S o p e rS / M M modules that utilize the new and innovative space saving TSOP
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DPD16MS40PKW5
S40PKW
72-pin
100ns
D032
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 640 Megabit CMOS DRAM DPD16MX40PKW5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The DPD16MX40PKW5 is the 16 Meg x 40 ECC Dynamic RAM module in the family of SuperSIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of 4 stacks consisting of four 16 Meg x
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DPD16MX40PKW5
DPD16MX40PKW5
72-pin
3QA153-10
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Untitled
Abstract: No abstract text available
Text: D E N S E - P A 512 Megabit C M O S D R A M C M I C E OS Y S T EM S DPD16MS32PW5 PRELIMINARY DESCRIPTION: The DPD16MS32PW 5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM1*1 modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface
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MS32PW5
DPD16MS32PW
72-pin
100ns
30A146-00
DPD16MS32PW5
California92841-1428
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 512 Megabit CMOS DRAM DPD16MS32PW5 MICROSYSTEMS ADVA N CED INFORM ATION PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS32PW5 is the 16 Meg x 32 Dynamic RAM module in the fam ily of S uper SIMM modules that utilize the new and innovative space saving TSOP
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DPD16MS32PW5
DPD16MS32PW5
72-pin
100ns
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du27
Abstract: AL3124 d04s DU32 1-23AL
Text: DENSE-PAC 1152 Megabit CMOS DRAM MI C R O S Y Ë T EM S DPD16MS72RW5 ADVANCED INFORMATION PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS72RW5 is the 16 Meg x 72 Dynamic RAM module in the family of Super DIMM modules that utilize the new and innovative space saving TSOP
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DPD16MS72RW5
DPD16MS72RW5
168-pin
30A182-CO
du27
AL3124
d04s
DU32
1-23AL
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DQ2451
Abstract: DPD16MS32P
Text: DENSE-PAC 512 Megabit CMOS DRAM M I C R O S Y ST E M S DPD16MS32PW5 P R E L IM IN A R Y DESCRIPTION: The DPD16MS32PW5 is the 16 Meg x 32 Dynamic RAM module in the family of S u per SIM/VP modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of eight dynamic RAM stacks surface
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DPD16MS32PW5
DPD16MS32PW5
72-pin
100ns
30A146-00
California92841-1428
30A146-00
DQ2451
DPD16MS32P
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 576 Megabit CMOS DRAM DPD16MX36PKW5 PRELIMINARY D E S C R IP T IO N : The DPD16MX36PKW5 is the 16 Meg x 36 Dynamic RAM module in the family of S u p erS IM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twelve dynamic RAM stacks
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DPD16MX36PKW5
DPD16MX36PKW5
72-pin
30A152-11
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DQ29-DQ31
Abstract: No abstract text available
Text: D E N S E -P A C 576 Megabit CMOS DRAM MICROSYSTEMS DPD16MS36PKW5 PRELIMINARY D ESCRIPTIO N : PIN -OUT DIAGRAM The DPD16MS36PKW5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP
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DPD16MS36PKW5
DPD16MS36PKW5
72-pin
30A152-10
100ns
PE51C
DQ29-DQ31
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 576 Megabit CMOS DRAM DPD16ML36PL5/DPD16ML36PW5 MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: The DPD16ML36PL5 and the DPD16ML36PW5 are the Low Profile 16 Meg x 36 Dynamic RAM module in the family of SuperSIM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed
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DPD16ML36PL5/DPD16ML36PW5
DPD16ML36PL5
DPD16ML36PW5
72-pin
DPD16ML36PL5/DPD16ML36PW5
30A15M
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16M 72PIN
Abstract: No abstract text available
Text: DENSE-PAC o vi i c R 576 Megabit CMOS DRAM DPD16MS36RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS36RW is the 16 Meg x 36 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of eight 16M x 4 and four 16M x 1 dynamic RAMs surface mounted on an industry
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DPD16MS36RW
DPD16MS36RW
72-pin
DQ0-DQ31
100ns
30A172-00
16M 72PIN
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Untitled
Abstract: No abstract text available
Text: PENSE-PAC M Í Ü R O S YS T IÍM S 64 Megabit CM OS DRAM DPD16MX4PKY5 D E SC R IP T IO N : The DPD16MX4PKY5 is the 16 Meg x 4 Dynamic RAM module that utilize the new and innovative space saving 300 mil TSOP stacking technology. The module is constructed of four 16 Megx 1 Dynamic RAM's.
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DPD16MX4PKY5
DPD16MX4PKY5
30A149-14
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC o vi i c R 512 Megabit CMOS DRAM DPD16MS32RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD16MS32RW is the 16 Meg x 32 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of eight 16M x 4 dynamic RAM surface mounted on an industry standard 72-pin
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DPD16MS32RW
DPD16MS32RW
72-pin
100ns
30A173-00
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Untitled
Abstract: No abstract text available
Text: 128 Megabit CMOS DRAM Dense-Pac Microsystems. Inc. ^ DPD16MX8PH4 PRELIMINARY DESCRIPTION: The DPD16MX8PH4 DRAM module is a revo lu tio n ary m em ory system using Dense-Pac M icrosystem s' new 2nd G eneration Stacking Technology. The module combines eight stackable ceramic
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DPD16MX8PH4
DPD16MX8PH4
100ns
PHET17
100ns
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 512 Megabit CMOS DRAM MICROSYSTEMS DPD16MX32PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD16MX32PKW5 is the 16 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of 12 dynamic RAM stacks surface
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DPD16MX32PKW5
DPD16MX32PKW5
72-pin
3QA146-11
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A273D
Abstract: 16J3 512X32 48pin
Text: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32
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26-Pin
72-Pin
A273D
16J3
512X32
48pin
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DQ51d
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 1152 Megabit CMOS DRAM DPD16MS72PKW5 ADVANCED INFORMATION D E S C R IP T IO N : PIN -O U T DIAGRAM The DPD16MS72PKW5 is the 16 Meg x 72 Dynamic RAM module in the family of Super DIMM modules that utilize the new and innovative space saving TSOP
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DPD16MS72PKW5
DPD16MS72PKW5
168-pin
30A160-00
DQ51d
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dram zip 256kx16
Abstract: No abstract text available
Text: INDEX GENERAL PRO D U CT INFORM ATION Dense-Pac Memory Module and Monolithic . 4 Emerging Technology / P r o d u c t s . 5
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DPS1MS16P/XP
150ns,
DPS512S8H4
DPS512S8P/Pt/PLL
DPS512S8Ü
DPS256X24P
DPS256S32W
DPS256X32L/W
512Kx16,
256Kx32
dram zip 256kx16
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 576 Megabit CMOSDRAM vi i c Ro SYS r i: m s D PD 16M X36RW PRBJMINARY PIN-OUT DIAGRAM DESCRIPTION: T h e D PD 16M X 3 6 R W i s th e 1 6 M e g x 3 6 D ynam i c RAM m o d u ie an th e jam iiy o f m o d u l e s fh a t u t iliz e th e s p a c e s a v in g TSO P t e c h n o l o g y . T h e m o d u ie i s c o n s t r u c t e d
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X36RW
DPD16MX36RW
30A17240
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Untitled
Abstract: No abstract text available
Text: 512 MegabitDCMOSDRAM PD 16M X32RW DENSE-PAC vi i c Ro sys r i: m s PRBJMINARY PIN-OUT DIAGRAM DESCRIPTION: T h e D PD 16M X32RW is th e 1 6 M e g x 32 D ynam ic RAM m o d u Je in th e Jam Hy o f m o d u ie s th a tu tU iz e th e sp a c e sa v in g TSO P te c h n o ] o g y . T h e m o d u ie is c o n stru c te d
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X32RW
X32RW
DPD16MX32RW
JJ-10
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