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    ECX-2766 Search Results

    ECX-2766 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    TLP2766A Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), High-speed, 20 Mbps, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    77313-827-66LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions Visit Amphenol Communications Solutions
    77313-427-66LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions Visit Amphenol Communications Solutions
    77313-127-66LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions Visit Amphenol Communications Solutions

    ECX-2766 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    ECX-2766-11.0592M Ecliptek CRYSTALS 50/50 32PF 0+70 50 11.0592MHZ FUND HC-49/UP SMD HC-49/UP Original PDF
    ECX-2766-11.0592M TR Ecliptek CRYSTALS 50/50 32PF 0+70 50 11.0592MHZ FUND HC-49/UP SMD HC-49/UP Original PDF