MIL-HDBK-263
Abstract: S1025
Text: Bulletin I - 0165J rev. A 12/05 FD075T06A5B FRED Die in Wafer Form z z 600V VF = 0.95V typ. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VFM VRRM IRM trr
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Original
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PDF
|
0165J
FD075T06A5B
100Aability,
12-Mar-07
MIL-HDBK-263
S1025
|
S1025 equivalent
Abstract: No abstract text available
Text: Bulletin I - 0165J rev. A 12/05 FD075T06A5B FRED Die in Wafer Form z z 600V VF = 0.95V typ. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VFM VRRM IRM trr
|
Original
|
PDF
|
0165J
FD075T06A5B
S1025 equivalent
|