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    FD100U06A5B

    Abstract: MIL-HDBK-263 S1025 0517J
    Text: Bulletin I - 0517J rev. C 03/07 FD100U06A5B FRED Die in Wafer Form z z 600V VF = 1.9V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified)


    Original     		0517J FD100U06A5B 280nC 12-Mar-07 FD100U06A5B MIL-HDBK-263 S1025 PDF

    Untitled

    Abstract: No abstract text available
    Text: I - 0517J rev. A FD100U06A5B FRED Die in Wafer Form z 600V VF = 1.25V typ. 5" Wafer 100% Tested at Probe c Electrical Characteristics Parameter VFM VFM VRRM IRM trr Description Typical Forward Voltage Typical Forward Voltage Minimum Reverse Breakdown Voltage


    Original     		0517J FD100U06A5B PDF

    Untitled

    Abstract: No abstract text available
    Text: I - 0517J rev. B FD100U06A5B FRED Die in Wafer Form z 600V VF = 1.25V typ. 5" Wafer 100% Tested at Probe c Electrical Characteristics Parameter VFM VFM VRRM IRM trr Description Typical Forward Voltage Typical Forward Voltage Minimum Reverse Breakdown Voltage


    Original     		0517J FD100U06A5B PDF