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    EDH8816C-12

    Abstract: EDH8816C-15 EDH8816C-20
    Text: Electronic Designs Inc. H8816C-12/15/20 16K x 8 SRAM CMOS Th e H8816C 16K x 8 uses the advanced Electronic Designs Inc. M EM ORY-PACK packaging concept which mounts several LC C memory devices on a single multilayer ceramic substrate. The ED H8816C is part of the EBM-pack


    OCR Scan     		EDH8816C-12/15/20 EDH8816C EDH8816C EDH8816C-12 EDH8816C-15 EDH8816C-20 PDF

    EDH8816C-12

    Abstract: EDH8816C-15 EDH8816C-20
    Text: Electronic Designs Ir H8816C-12/ 15/20 MILITARY 16K x 8 SRAM CMOS The H8816C <16K x 8 uses the advanced Electronic Designs Inc. M EM O R Y-PAC K packaging concept w hich m o un ts several LC C m em ory devices on a single m ultilayer ceram ic substrate. The H8816C is part o f the EBM -pack


    OCR Scan     		EDH8816C-12/15/20 EDH8816C EDH8816Cis EDH8816C-12 EDH8816C-15 EDH8816C-20 PDF