Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    IGC39T65T8M Search Results

    SF Impression Pixel

    IGC39T65T8M Price and Stock

    Infineon Technologies AG IGC39T65T8MX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC39T65T8MX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas IGC39T65T8MX1SA1 Waffle Pack 57
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    IGC39T65T8M Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: IGC39T65T8M IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology  high short circuit capability, self limiting short circuit current  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target


    Original     		IGC39T65T8M L7572M, PDF

    Untitled

    Abstract: No abstract text available
    Text: IGC39T65T8M IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology  high short circuit capability, self limiting short circuit current  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target


    Original     		IGC39T65T8M IEC62258-3 L7572M, PDF