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    Infineon Technologies AG IGC89T170S8RMX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC89T170S8RMX1SA1)
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    Avnet Americas IGC89T170S8RMX1SA1 Waffle Pack 2,655
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    EBV Elektronik IGC89T170S8RMX1SA1 71 Weeks 1
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    Untitled

    Abstract: No abstract text available
    Text: IGC89T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives G Chip Type


    Original     		PDF IGC89T170S8RM L7773O, L7773T, L7773E,

    IGC89T170S8RM

    Abstract: No abstract text available
    Text: IGC89T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives G Chip Type


    Original     		PDF IGC89T170S8RM L7773O, IGC89T170S8RM