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    Catalog Datasheet MFG & Type Document Tags PDF

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    Text: PD - 97077 IRLC3103B HEXFET Power MOSFET Die in Wafer Form l l D 100% Tested at Probe  Available in Chip Pack, Unsawn wafer, Sawn on Film ‚ G 30V RDS on = 0.019Ω (max.) 6" Wafer S Key Electrical Characteristics @TJ=25°C (unless otherwise specified) (D-Pak package)d


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