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Catalog Datasheet	MFG & Type	PDF	Document Tags
DIM800DCS12-A000 Abstract: DIM800DCS12-A Text: 16 3 Replaces DS5839-1.1 FEATURES ±0.2 • 10µs Short Circuit Withstand  Non Punch Through Silicon  Isolated Cu Base With Al2O3 Substrates  Lead Free Construction DS5839-2 July 2014 LN31760 KEY PARAMETERS 6 x O7 VCES VCE(sat) * (typ) IC (max)	Original	PDF	DS5839-1 DIM800DCS12-A000 DIM800DCS12-A

Catalog Datasheet

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PDF

Document Tags

DIM800DCS12-A000

Abstract: DIM800DCS12-A
Text: 16 3 Replaces DS5839-1.1 FEATURES ±0.2 • 10µs Short Circuit Withstand  Non Punch Through Silicon  Isolated Cu Base With Al2O3 Substrates  Lead Free Construction DS5839-2 July 2014 LN31760 KEY PARAMETERS 6 x O7 VCES VCE(sat) * (typ) IC (max)

Original

PDF

DS5839-1 DIM800DCS12-A000 DIM800DCS12-A