MH25632CNXJ-7
Abstract: No abstract text available
Text: MITSUBISHI LSIs DRAM MODULE MH25632CNXJ-6,-7 FAST PAGE MODE 83886Q8-BIT(262144-WORD BY 32-BIT)DYNAMIC RAM DESCRIPTION PIN CONFIGURATION (TOP VIEW) [Single side] The M H25632CN XJ is 262144-word by 32-bit dynamic RAM module. That module consists of two industry 256K
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MH25632CNXJ-6
83886Q8-BIT
262144-WORD
32-BIT
H25632CN
MH2S632CNXJ-6
MH25632CNXJ--7
MH25632CNXJ-7
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Untitled
Abstract: No abstract text available
Text: MITSUBISHI LSIs DRAM MODULE FAST PAGE MODE DYNAMIC RAM 81 256K X 32 O M BIT Max. Type name Access Load memory time Outward dimensions Data sheet W x H x D (mm) page (ns) MH25632CNXJ-6 60 MH25632CNXJ-7 70 M5M44260CJ x 2 COMMON DATA 107.95 x 17.5 x 5.00 3 /7
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MH25632CNXJ-6
MH25632CNXJ-7
M5M44260CJ
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Untitled
Abstract: No abstract text available
Text: MITSUBISHI LSIs DRAM MODULE MH25632CNXJ-6.-7 FAST PAGE MODE 83886Q8-BIT(262144-WORD BY 32-BIT)DYNAMIC RAM DESCRIPTION The MH25632CNXJ is 262144-word by 3 2 -bit dynamic RAM module. That module consists of two industry 256K x 32 dynamic RAMs in SOJ. The mounting of SOJ on a single in-line package provides
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MH25632CNXJ-6
83886Q8-BIT
262144-WORD
32-BIT
MH25632CNXJ
MH25632CNXJ-6
HH25632CNXJ-7
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30-pin simm memory "16m x 8"
Abstract: M5M44100 M5M418165CJ M5M44400 mh4m09caj7 MH4M09CAJ-7
Text: •D YNAM IC RAM MODULES • 30 pin S IM M /S IP Memory capacity Bit Configuration Word X Bit Power suppiy voltage Load memories Packaoe outline Outward dimensions W X H X D fm m ) 1ft case ol module with fead is loaded high Contact N i+Solder plating SIMM
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M5M44400CJx2
M5M44100CJx8
M5M417400Cvix2
M5M417400CJx2
M5M44100C
256KX32
512Kx32
M5M44260CJx2
M5M44260CJx4
95X17
30-pin simm memory "16m x 8"
M5M44100
M5M418165CJ
M5M44400
mh4m09caj7
MH4M09CAJ-7
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