S-PQFP-G64 Package
Abstract: powerPAD MS-026 M3332
Text: MECHANICAL DATA MPQF047 – JANUARY 1998 PHD S-PQFP-G64 PowerPAD PLASTIC QUAD FLATPACK (DIE DOWN) 0,40 0,30 0,80 48 0,20 M 33 32 49 Thermal Pad (see Note D) 0,13 NOM 64 17 Gage Plane 1 16 12,00 TYP 14,05 SQ 13,95 0,25 0,15 0,05 0°– 7° 0,75 0,45 16,15
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Original
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MPQF047
S-PQFP-G64)
4087742/A
MS-026
S-PQFP-G64 Package
powerPAD
MS-026
M3332
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PDF
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MS-026
Abstract: No abstract text available
Text: MECHANICAL DATA MPQF047 – JANUARY 1998 PHD S-PQFP-G64 PowerPAD PLASTIC QUAD FLATPACK (DIE DOWN) 0,40 0,30 0,80 48 0,20 M 33 32 49 Thermal Pad (see Note D) 0,13 NOM 64 17 Gage Plane 1 16 12,00 TYP 14,05 SQ 13,95 0,25 0,15 0,05 0°– 7° 0,75 0,45 16,15
|
Original
|
MPQF047
S-PQFP-G64)
4087742/A
MS-026
|
PDF
|