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    PCN0119

    Abstract: Nitto-HC100 HC100 shin-etsu nitto hc100 Nitto HC 672-BALL Compound Nitto EP20K200E
    Text: PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall


    Original     		PCN0119 HC-100. HC-100 EPF10K100E 484-Ball EPF10K130E EP20K200E 484-Ball PCN0119 Nitto-HC100 HC100 shin-etsu nitto hc100 Nitto HC 672-BALL Compound Nitto PDF