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Catalog Datasheet	MFG & Type	Document Tags	PDF
PCN0512 Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i Text: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia	Original	PCN0512 SUMITOMO-G600 MP8000 EPC1064 EPC1064V EPC1213 EPC1441 PCN0512 G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I altera EPM7032S mold compound altera EPM7032B ep600i	PDF

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PCN0512

Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i
Text: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia

Original

PCN0512 SUMITOMO-G600 MP8000 EPC1064 EPC1064V EPC1213 EPC1441 PCN0512 G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I altera EPM7032S mold compound altera EPM7032B ep600i

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