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    Untitled

    Abstract: No abstract text available
    Text: Reportable Substances in Components Package Type : QFN5032 Component Weight : Document No : 20 Process Type : Lead #: No 1 Content in % Material 0.0210376 Silica Fused 40.28% 6 % to % to Unit Content PPM 60676-86-0 0.0192914 91.700% 47.633% Trade secret 0.0008415


    Original     		PDF QFN5032 QFN5032-20LD-GRN-RS-18 031314HC08

    LQFP-128L

    Abstract: LQFP128L
    Text: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER


    Original     		PDF FCQFN46-34L FQFN33-16L, FQFN44-26L, H3QFN1212-64L H3QFN88-52L H4QFN1010-52L QFN56-30L H4QFN1212-64L LGA5032-06L LGA5555-76L LQFP-128L LQFP128L