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    SL2ICS5401 Price and Stock

    NXP Semiconductors SL2ICS5401EW-V7,00

    IC I-CODE SLI SMART LABEL DIE
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    DigiKey SL2ICS5401EW-V7,00 Bulk
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    NXP Semiconductors SL2ICS5401EW/V7,00

    SL2ICS5401EW/UNCASED/FOIL//V7 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SL2ICS5401EW/V7,00)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SL2ICS5401EW/V7,00 Waffle Pack 28,477
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    SL2ICS5401 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SL2ICS5401EW/V7 NXP Semiconductors SL2 ICS53/SL2 ICS54 ICODE SLI-S/HC Functional Specification Original PDF
    SL2ICS5401EW/V7 NXP Semiconductors Data sheet addendum; SL2ICS5401EW/V7 Bumped sawn wafer on UV-tape specification Original PDF
    SL2ICS5401EW/V7,00 NXP Semiconductors SL2ICS5401EW/V7 - SL2 ICS53/SL2 ICS54 ICODE SLI-S/HC Functional Specification, NAU000 Package, No Marking, Chips On Wafer, Pre-Sawn, On FFC Original PDF

    SL2ICS5401 Datasheets Context Search

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    Abstract: No abstract text available
    Text: SL2MOS5401 Addendum contactless chip card module specification Rev. 3.0 — 15 January 2009 Product data sheet 168230 PUBLIC 1. General description This document gives specifications for the product SL2MOS5401. • The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1.


    Original     		PDF SL2MOS5401 SL2MOS5401. SL2MOS5401 SL2ICS5401 OT500AA1. SL2ICS53/SL2ICS54"