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    T1610P Search Results

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    T1610P Price and Stock

    TE Connectivity CIRHSE06T1610PCNF80M32V0

    CONN PLUG HSNG MALE 3POS INLINE
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    DigiKey CIRHSE06T1610PCNF80M32V0 Bag 19 1
    • 1 $50.13
    • 10 $41.551
    • 100 $34.4894
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    TME CIRHSE06T1610PCNF80M32V0 25 1
    • 1 $43.0669
    • 10 $42.2792
    • 100 $37.3294
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    Chip1Stop CIRHSE06T1610PCNF80M32V0 25
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    • 100 $41.2
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    IBS Electronics CIRHSE06T1610PCNF80M32V0 25 23
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    • 100 $39.078
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    PEI Genesis MS3459KT16-10P

    AE5 3C 3#12 PIN PLUG
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    DigiKey MS3459KT16-10P Box 17 1
    • 1 $103.76
    • 10 $89.93
    • 100 $62.26
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    PEI Genesis AE559KT16-10P-LC

    AE5 3C 3#12 PIN PLUG
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    DigiKey AE559KT16-10P-LC Box 17 1
    • 1 $95.76
    • 10 $82.99
    • 100 $57.46
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    PEI Genesis AE559KT16-10PW-LC

    AE5 3C 3#12 PIN PLUG
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    DigiKey AE559KT16-10PW-LC Box 17 1
    • 1 $95.76
    • 10 $82.99
    • 100 $57.46
    • 1000 $57.46
    • 10000 $57.46
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    PEI Genesis AE559KT16-10PX-LC

    AE5 3C 3#12 PIN PLUG
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    DigiKey AE559KT16-10PX-LC Box 17 1
    • 1 $95.76
    • 10 $82.99
    • 100 $57.46
    • 1000 $57.46
    • 10000 $57.46
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    T1610P Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    T1610P-SD-F Vishay Semiconductor Opto Division Sensors, Transducers - Optical Sensors - Photodiodes - PHOTODIODE PIN CHIP 560NM CHIP Original PDF

    T1610P Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity


    Original
    PDF T1610P T1610P 2002/95/EC 2002/96/EC 2011/65/EU 2002/95/EC. 2011/65/EU. 12-Mar-12

    Untitled

    Abstract: No abstract text available
    Text: T1610P www.vishay.com Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip A • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7


    Original
    PDF T1610P T1610P 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    FVOV6870

    Abstract: MIL-HDBK-263
    Text: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity


    Original
    PDF T1610P T1610P 2002/95/EC 2002/96/EC 11-Mar-11 FVOV6870 MIL-HDBK-263

    Untitled

    Abstract: No abstract text available
    Text: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity


    Original
    PDF T1610P T1610P 2002/95/EC 18-Jul-08

    FVOV6870

    Abstract: MIL-HDBK-263 PIN photodiode chip photodiode die WAFER
    Text: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity


    Original
    PDF T1610P T1610P 2002/95/EC 2002/96/EC 18-Jul-08 FVOV6870 MIL-HDBK-263 PIN photodiode chip photodiode die WAFER

    FVOV6870

    Abstract: MIL-HDBK-263 chip diode "sawn on foil" photodiode CIE eye response
    Text: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity


    Original
    PDF T1610P T1610P 2002/95/EC 2002/96/EC 18-Jul-08 FVOV6870 MIL-HDBK-263 chip diode "sawn on foil" photodiode CIE eye response

    Untitled

    Abstract: No abstract text available
    Text: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity


    Original
    PDF T1610P T1610P 2002/95/EC 2002/96/EC 2002/95/EC. 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: V I S H AY I N T E R T E C H N O L O G Y, I N C . OPTOELECTRONICS Bare Die Optoelectronics Bare Die Portfolio Infrared Emitters and Photo Detectors TABLE OF CONTENTS Introduction to Bare


    Original
    PDF VMN-SG2200-1502