Untitled
Abstract: No abstract text available
Text: HM12-10001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-10001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-16001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-16001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-07001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-07001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-01001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-01001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-06001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-06001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM37-1007R17LF summary material content, BI Technologies Corporation Index Item Material Name SI CORE M21 SU CORE M21 COIL Enamelled Copper Magnet Wire 1 2 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy TB2272 5 SPACER Nomex Paper Element Composition CAS No Fe2O3
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HM37-1007R17LF
TB2272
Nylon66
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Untitled
Abstract: No abstract text available
Text: HM12-02502LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-02502LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM37-1609R32LF summary material content, BI Technologies Corporation Index Item Material Name SI CORE M21 SU CORE M21 COIL Enamelled Copper Magnet Wire 1 2 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy TB2272 5 SPACER Nomex Paper Element Composition CAS No Fe2O3
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HM37-1609R32LF
TB2272
Nylon66
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Untitled
Abstract: No abstract text available
Text: HM12-03501LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-03501LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-15001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-15001LF
TB2272
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TB2272
Abstract: No abstract text available
Text: 23-Jul-09 HM73-106R0LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Iron Powder 2 ADHESIVE Epoxy 3 WIRE Air Coil 4 BODY Ink 5 SOLDER Lead Free Solder CAS No Material Mass mg Composition (mg) 7439-89-6 - 855 846.45
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23-Jul-09
HM73-106R0LF
471-34-ect
7440-50-8ad
TB2272
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Untitled
Abstract: No abstract text available
Text: HM65-6R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Ferrite Core I CORE Ferrite Core 2 COIL Enamelled Copper Wire 3 SOLDER Lead Free Solder 1 L.C.P 4 5 HEADER WITH LEAD FREE DUMMY SPACER Dummy Lead Nomex Paper Epoxy TB3300HL
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HM65-6R0LF
TB3300HL
TB2272L
010thers
Nylon66
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