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    TC358774XBG Price and Stock

    Toshiba America Electronic Components TC358774XBG

    Features: MIPI DSI 1.01 to LVDS Single Link, Up to UXGA (1600 x 1200, 60 fps, 24 bpp), Application scope: tablet, Ultrabook, 1.2V (MIPI/Core), 1.8V (LVDS), 1.8 to 3.3V (I/O) - Rail/Tube (Alt: TC358774XBG)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas TC358774XBG Tube 26 Weeks 2,450
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    Toshiba America Electronic Components TC358774XBG(EL)

    Display Interface Bridge 49-Pin VFBGA - Tape and Reel (Alt: TC358774XBG(EL))
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas TC358774XBG(EL) Reel 26 Weeks 1,000
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    EBV Elektronik TC358774XBG(EL) 35 Weeks 1,000
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    TC358774XBG Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: TC358774XBG/TC358775XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358774XBG, TC358775XBG Mobile Peripheral Devices TC358774XBG Overview The TC358774XBG/TC358775XBG Functional Specification defines operation of the DSI TO LVDS low power chip or more abbreviated,


    Original
    PDF TC358774XBG/TC358775XBG TC358774XBG, TC358775XBG TC358774XBG TC358774XBG/TC358775XBG TC358775XBG 775XBG TC358764XBG/ TC35865XBG, P-TFBGA49-0505-0

    1 to 2 MIPI buffer IC

    Abstract: TC3587 BGA64
    Text: TC358771XBG, TC358772XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358771XBG, TC358772XBG Mobile Peripheral Devices TC358771XBG Overview The TC358771XBG/TC358772XBG Functional Specification adds back light engine to function of 775XBG. TC358771XBG/TC358772XBG is the


    Original
    PDF TC358771XBG, TC358772XBG TC358771XBG TC358771XBG/TC358772XBG 775XBG. TC358774XBG/TC358775XBG, TC358774XBG/TC358775XBG 1 to 2 MIPI buffer IC TC3587 BGA64