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Catalog Datasheet	MFG & Type	Document Tags	PDF
.47j 63v Abstract: No abstract text available Text: THOMSON COMPONENTS THOMSON PASSIVE MbE D • TD263DS DD0037b T ■ THP TYPE AC / AN MULTILAYER CERAMIC CHIP CAPACITORS /?-PF~û5-& 7 PHYSICAL C H A R A C TER ISTIC S TERM INATIO N Standard: Silver palladium metallization. Can meet reflow solder specifications for 5 sec. @ 260°C.	OCR Scan	TD263DS DD0037b -220pF .47j 63v	PDF

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.47j 63v

Abstract: No abstract text available
Text: THOMSON COMPONENTS THOMSON PASSIVE MbE D • TD263DS DD0037b T ■ THP TYPE AC / AN MULTILAYER CERAMIC CHIP CAPACITORS /?-PF~û5-& 7 PHYSICAL C H A R A C TER ISTIC S TERM INATIO N Standard: Silver palladium metallization. Can meet reflow solder specifications for 5 sec. @ 260°C.

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TD263DS DD0037b -220pF .47j 63v

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