TDA19988AU Search Results

TDA19988AU Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
TDA19988AU		NXP Semiconductors	Bare die; 84 bond pads		Original	PDF

TDA19988AU Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Bare die outline Bare die; 84 bond pads; 2.856 x 2.856 x 0.738 mm TDA19988AU D 84 66 1 65 e x E y 43 22 23 42 X Y P1 P2 P4 P3 A A2 A1 detail X detail Y Dimensions Unit A 1 A1 A2 D(2) E(2) e(3) max nom 0.738 0.013 0.725 2.856 2.856 min mm 0.08 P1(4) P2(5)	Original	TDA19988AU tda19988au	PDF

Catalog Datasheet

MFG & Type

Document Tags

PDF

Untitled

Abstract: No abstract text available
Text: Bare die outline Bare die; 84 bond pads; 2.856 x 2.856 x 0.738 mm TDA19988AU D 84 66 1 65 e x E y 43 22 23 42 X Y P1 P2 P4 P3 A A2 A1 detail X detail Y Dimensions Unit A 1 A1 A2 D(2) E(2) e(3) max nom 0.738 0.013 0.725 2.856 2.856 min mm 0.08 P1(4) P2(5)

Original

TDA19988AU tda19988au

PDF