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    TIM7785-30SL Search Results

    TIM7785-30SL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    76342-330SLF Amphenol Communications Solutions Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 60 Positions, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    71991-330SLF Amphenol Communications Solutions Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 60 Position, 2.54mm (0.100in) Pitch Visit Amphenol Communications Solutions
    89361-130SLF Amphenol Communications Solutions Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle. Visit Amphenol Communications Solutions
    89947-130SLF Amphenol Communications Solutions Minitek® 2.00mm, Wire/Cable To Board Connectors, IDC 2mm Receptacle Board/Wire to Board Connectors, Double Row, 30 Position, 2mm Pitch Visit Amphenol Communications Solutions
    89361-730SLF Amphenol Communications Solutions Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle. Visit Amphenol Communications Solutions

    TIM7785-30SL Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TIM7785-30SL Toshiba C-Band Power GaAs IMFETs; Frequency Band (GHz): 7.7-8.5; P1dB (dBm): 45; G1dB (dB): 6; Ids (A) Typ.: 7; IM3 (dBc) Typ.: -45; Rth (°C/W) Typ.: 1; Package Type: 2-16G1B Original PDF
    TIM7785-30SL Toshiba Microwave Power GaAs FET Scan PDF
    TIM7785-30SL Toshiba MICROWAVE POWER GaAs FET Scan PDF