AX1015
Abstract: A0649869 AX-110BT AX100041 A0390851 AX-5270 A0408829 AX100045 AX101411 AX102212
Text: C O M M E R C I A L N E T W O R K I N G — O P T I C A L F I B E R 16.4 FiberExpress Connectors Optimax Field Installable Connectors and Installation Tool Kits AX101982 Optimax LC Connector Optimax Field Installable Connector The Optimax Connectors are reliable field installable optical fiber connectors that are easy to install.
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AX101982
10Base-T,
RJ-45,
10Base-FL,
10Base2,
RJ-45
10Base-T
AX-200
AX-270
AX-280
AX1015
A0649869
AX-110BT
AX100041
A0390851
AX-5270
A0408829
AX100045
AX101411
AX102212
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PDF
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Untitled
Abstract: No abstract text available
Text: SMA Connectors for Flexible Cable MIL-C-39012/55 SMA PLUG OUTER SLEEVE SLEEVE 7 .9 FIGURE 1 M ILITA R Y P A R T NO. M IDW EST P A R T NO. FIGURE 2 FIGURE A SS E M B LY PROCEDURE CATEGORY C A B LE TYPE C OM M ERCIAL ALTE R N A TE -3 0 0 6 -3 0 0 7 -3 0 0 8
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OCR Scan
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MIL-C-39012/55
39012/5I
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PDF
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marking alpha omega
Abstract: alpha marking code A03160 ALPHA OMEGA PART MARKING sot23 marking UA alpha week code
Text: pnm Document No. ALPHA & OMEGA SEMICONDUCTOR Version Title SOT-23 PACKAGE MARKING DESCRIPTION NOTE: P - Package and product type N - Last digital of product number W - Week code A - Assembly location code L&T - Assembly lot code PART NO. DESCRIPTION CODE PN
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OCR Scan
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PD-01566
A03160
OT-23
A03160L
marking alpha omega
alpha marking code
ALPHA OMEGA PART MARKING
sot23 marking UA
alpha week code
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PDF
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TN2130
Abstract: No abstract text available
Text: Supertex inc. TN2130 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2130 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TN2130
TN2130
A031610
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PDF
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VN2110
Abstract: No abstract text available
Text: Supertex inc. VN2110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN2110 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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VN2110
VN2110
A031610
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PDF
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TN0620
Abstract: No abstract text available
Text: Supertex inc. TN0620 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN0620 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TN0620
TN0620
A031610
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PDF
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DN3135
Abstract: No abstract text available
Text: Supertex inc. DN3135 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) DN3135 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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Original
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DN3135
DN3135
A031610
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PDF
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vn3205
Abstract: No abstract text available
Text: Supertex inc. VN3205 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VN3205 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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VN3205
VN3205
A031610
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PDF
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VN2450
Abstract: No abstract text available
Text: Supertex inc. VN2450 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VN2450 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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VN2450
VN2450
A031610
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PDF
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TN2425
Abstract: No abstract text available
Text: Supertex inc. TN2425 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TN2425 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TN2425
TN2425
A031610
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PDF
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DN2625
Abstract: No abstract text available
Text: Supertex inc. DN2625 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 70 70 11 ± 1.5 Au 1 (mils) DN2625 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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DN2625
DN2625
A031610
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PDF
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VP0808
Abstract: No abstract text available
Text: Supertex inc. VP0808 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) VP0808 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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VP0808
VP0808
A031610
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PDF
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VN3515
Abstract: No abstract text available
Text: Supertex inc. VN3515 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN3515 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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VN3515
VN3515
A031610
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PDF
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H957
Abstract: 825 384 6 TACT2
Text: Supertex inc. HV9957 Six-Channel LED Driver with Integrated Fault Protection Features XX Drives six strings of LEDs, up to 30mA each XX Phased PWM dimming XX Pin-programmable dimming frequency or synchronizable to an external signal XX PWM dimming to very low duty cycles
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24-Lead
HV9957
DSFP-HV9957
A062811
H957
825 384 6
TACT2
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PDF
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TP2520
Abstract: No abstract text available
Text: Supertex inc. TP2520 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2520 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TP2520
TP2520
A031610
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PDF
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TN5335
Abstract: No abstract text available
Text: Supertex inc. TN5335 Die Specification Pad Layout 1 2 0,0 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 56 8.0 ± 1.0 Au 1 (mils) TN5335 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TN5335
TN5335
A031610
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PDF
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TP2104
Abstract: No abstract text available
Text: Supertex inc. TP2104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TP2104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TP2104
TP2104
A031610
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PDF
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VP3203
Abstract: No abstract text available
Text: Supertex inc. VP3203 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VP3203 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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VP3203
VP3203
A031610
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PDF
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DN3535
Abstract: No abstract text available
Text: Supertex inc. DN3535 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN3535 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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DN3535
DN3535
A031610
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PDF
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TN2540
Abstract: No abstract text available
Text: Supertex inc. TN2540 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2540 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TN2540
TN2540
A031610
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PDF
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TP2540
Abstract: No abstract text available
Text: Supertex inc. TP2540 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2540 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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Original
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TP2540
TP2540
A031610
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PDF
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TP2424
Abstract: No abstract text available
Text: Supertex inc. TP2424 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TP2424 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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Original
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TP2424
TP2424
A031610
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PDF
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TP0604
Abstract: No abstract text available
Text: Supertex inc. TP0604 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TP0604 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description
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TP0604
TP0604
A031610
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PDF
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Untitled
Abstract: No abstract text available
Text: HV4522 HV4622 32-Channel Serial To Parallel Converter with P-Channel Open Drain Outputs Ordering Information Package Options Device Recommended Operating VPP Max 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier 44 Quad Plastic Gullwing
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Original
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HV4522
HV4622
32-Channel
HV4522DJ
HV4522PJ
HV4522PG
HV4522X
HV4622DJ
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PDF
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