VN2224
Abstract: No abstract text available
Text: VN2224 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 70 85 11 ± 1.5 Au 1 (mils) VN2224 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VN2224
VN2224
A040609
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VP2206
Abstract: No abstract text available
Text: VP2206 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 70 85 11 ± 1.5 Au 1 (mils) VP2206 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VP2206
VP2206
A040609
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TP0620
Abstract: No abstract text available
Text: TP0620 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) TP0620 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si
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TP0620
TP0620
A040609
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VN2210
Abstract: No abstract text available
Text: VN2210 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 70 85 11 ± 1.5 Au 1 (mils) VN2210 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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VN2210
VN2210
A040609
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