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    AA18 MARK Search Results

    AA18 MARK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    5962-8950303GC Rochester Electronics LLC ICM7555M - Dual Marked (ICM7555MTV/883) Visit Rochester Electronics LLC Buy
    54HC221AJ/883C Rochester Electronics LLC 54HC221AJ/883C - Dual marked (5962-8780502EA) Visit Rochester Electronics LLC Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy

    AA18 MARK Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PD6722 - Implementing DMA Functionality

    Abstract: CON AT62B LA18 74LS04 PAL20L88 AA23 AA17 LM386-1 CON AT36B con50a lm3861
    Text: PD6722 — Implementing DMA Functionality Application Note May 2001 As of May 2001, this document replaces the Basis Communications Corp. document AN-PD4. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    PD6722 2200pF CS4331-KS PD6722 - Implementing DMA Functionality CON AT62B LA18 74LS04 PAL20L88 AA23 AA17 LM386-1 CON AT36B con50a lm3861 PDF

    PD6729 - Routing PCMCIA Interrupts in a PCI-Based System

    Abstract: bridge ba20 SI9953DY AA23 BA23 BA24 BA25 CL-PD6729 PD6729 si9953dy cpu
    Text: PD6729 — Routing PCMCIA Interrupts in a PCI-Based System Application Note May 2001 As of May 2001, this document replaces the Basis Communications Corp. document AN-PD3. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    PD6729 CL-PD6729 1995S PD6729 - Routing PCMCIA Interrupts in a PCI-Based System bridge ba20 SI9953DY AA23 BA23 BA24 BA25 si9953dy cpu PDF

    MT29C1G12

    Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
    Text: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package


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    152-Ball 409ng 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29C1G12 mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1 PDF

    FBGA 896

    Abstract: AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
    Text: IGLOO e Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    256-Pin AGLE600 IO13NDB0V2 GAA0/IO00NDB0V0 GAC0/IO02NDB0V0 FBGA 896 AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1 PDF

    A104

    Abstract: AA10 AS3SSD16GB5PBG ata commands 16GB Nand flash dual channel flash chip 8gb silicon power 4GB AB22-AB23
    Text: SOLID STATE DISK PRELIMINARY Solid State Disk On Chip SSDoC AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG Not recommended for new designs. Contact Micross Marketing & Sales to discuss availability. The new microSSD is the recommended replacement part. FEATURES


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    AS3SSD16GB5PBG A104 AA10 AS3SSD16GB5PBG ata commands 16GB Nand flash dual channel flash chip 8gb silicon power 4GB AB22-AB23 PDF

    ICH4-M

    Abstract: 82801DB 852GM 852GMV AA10 VCC62 intel DOC 3053* intel
    Text: R Mobile Intel Pentium® 4 Processor-M and Intel® 852PM/GME/GMV Chipset Platform Design Guide Update April 2005 Notice: The Intel® 852PM/GME/GMV chipset families may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current


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    852PM/GME/GMV ICH4-M 82801DB 852GM 852GMV AA10 VCC62 intel DOC 3053* intel PDF

    capacitor AA8

    Abstract: CR21-000 resistor 30 pin flex circuit connector CR21-102J capacitor AA7 resistor network 102J TAJB107M016 AMP flex circuit connector mark W8 Diode schottky DIODE MOTOROLA B14
    Text: May 2001, ver. 1.02 Features Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ General Description Altera Corporation A-DS-PCI-C-01.01 FLEX 10KE PCI Development Board Universal 64-bit, 66-MHz peripheral component interconnect PCI expansion card Includes the FLEX® 10KE EPF10K200SFC-1 device


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    -DS-PCI-C-01 64-bit, 66-MHz EPF10K200SFC-1 144-pin 32-Mbyte RS-232 capacitor AA8 CR21-000 resistor 30 pin flex circuit connector CR21-102J capacitor AA7 resistor network 102J TAJB107M016 AMP flex circuit connector mark W8 Diode schottky DIODE MOTOROLA B14 PDF

    resistor network 102J

    Abstract: C51 development board CR21-102J TAJC477M010 capacitor AA7 diode AA19 altera board
    Text: June 2000, ver. 1.01 Features Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ General Description Altera Corporation A-DS-PCI-C-01.01 FLEX 10KE PCI Development Board Universal 64-bit, 66-MHz peripheral component interconnect PCI expansion card Includes the FLEX® 10KE EPF10K100EFC-1 device


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    -DS-PCI-C-01 64-bit, 66-MHz EPF10K100EFC-1 144-pin 32-Mbyte RS-232 resistor network 102J C51 development board CR21-102J TAJC477M010 capacitor AA7 diode AA19 altera board PDF

    mark AT0

    Abstract: 676-Pin B27 QFN ACTEL FBGA 144 R13NC IO30PDB1V1 IO06PDB0V1 IO10PDB0V1 AFS090
    Text: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    108-Pin AFS090 GCB1/IO35PDB1V0 GAA2/IO52PDB3V0 mark AT0 676-Pin B27 QFN ACTEL FBGA 144 R13NC IO30PDB1V1 IO06PDB0V1 IO10PDB0V1 PDF

    IO01

    Abstract: mark AT0 IO30PDB1V1 IO06PDB0V1 IO10PDB0V1
    Text: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    108-Pin AFS090 GCB1/IO35PDB1V0 GAA2/IO52PDevice IO01 mark AT0 IO30PDB1V1 IO06PDB0V1 IO10PDB0V1 PDF

    intel 31154

    Abstract: 31154 pci 31154 LT1085 M66EN w612 ad52 001 variable voltage regulator 0/intel 31154 L1014
    Text: Intel 31154 133MHz PCI Bridge Design-In Considerations with IBM PCI-X to PCI-X Bridge Application Note August 2003 Order Number: 278806-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    133MHz intel 31154 31154 pci 31154 LT1085 M66EN w612 ad52 001 variable voltage regulator 0/intel 31154 L1014 PDF

    LSISASx12

    Abstract: diode t25 4 F8 lsisas1064 diode t25 4 g8 epbga nas 7820 diode t25 4 d9 diode t25 4 j6 pinout scsi sata smp Y2
    Text: LSISASx12 3.0 Gbit/s Serial Attached SCSI Expander Datasheet Version 2.0 The LSISASx12 expander is a 12-port, 3 Gbit/s Serial Attached SCSI SAS expander device. The LSISASx12 expander provides the functionality for connecting targets and initiators. The expander provides


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    LSISASx12 12-port, diode t25 4 F8 lsisas1064 diode t25 4 g8 epbga nas 7820 diode t25 4 d9 diode t25 4 j6 pinout scsi sata smp Y2 PDF

    intel Chipset CRB Schematics

    Abstract: vga connector vga connector footprint intel 82801DB pin vga CRT pinout 82801DB 852GM AA10 SN74LVC2G125 intel DOC
    Text: R Mobile Intel Pentium® 4 Processor-M and Intel® 852GM Chipset Platform Design Guide Update April 2005 Notice: The Intel® 852GM chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata


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    852GM 852GM intel Chipset CRB Schematics vga connector vga connector footprint intel 82801DB pin vga CRT pinout 82801DB AA10 SN74LVC2G125 intel DOC PDF

    diode t25 4 L9

    Abstract: DIODE T25 4 t25 4 l9 diode t25 4 H9 diode t25 4 L5 diode t25 4 F6 DIODE MOTOROLA B34 SOCKET-PLCC20 T25 4 h5 t25 4 k8
    Text: August 1999, ver. 1 Features Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ General Description Altera Corporation A-DS-PCI-C-01 FLEX 10KE PCI Development Board Universal 64-bit, 66-MHz peripheral component interconnect PCI expansion card Includes the FLEX® 10KE EPF10K100EFC-1 device


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    -DS-PCI-C-01 64-bit, 66-MHz EPF10K100EFC-1 144-pin 32-Mbyte RS-232 MAX750A 330pF MBRS130LT3 diode t25 4 L9 DIODE T25 4 t25 4 l9 diode t25 4 H9 diode t25 4 L5 diode t25 4 F6 DIODE MOTOROLA B34 SOCKET-PLCC20 T25 4 h5 t25 4 k8 PDF

    LSISASx12

    Abstract: lsisas1064 pinout scsi sata msi g20 LSISAS ARM926 PAR64 Serial NVSRAM LSI Logic SAS controller chip CPCI-64
    Text: LSISAS1064 4-Port 3 Gbit/s Serial Attached SCSI Controller Datasheet Version 2.0 The LSISAS1064 is a 4-port, 3.0 Gbit/s SAS/SATA controller that is compliant with the Fusion-MPT architecture, provides a PCI-X interface, and supports Integrated RAID™.


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    LSISAS1064 64-bit, LSISASx12 pinout scsi sata msi g20 LSISAS ARM926 PAR64 Serial NVSRAM LSI Logic SAS controller chip CPCI-64 PDF

    RX22p

    Abstract: H20B2 AA19 AA23 AA30 AG27
    Text: EP2A40 I/O Pins ver. 1.1 Table 1 shows all pins for the EP2A40 672-pin FineLine BGA, 724-pin ball-grid array BGA , and 1,020-pin FineLine BGA Table 1. EP2A40 Device Pin-Outs Pin Dual-Purpose I/O & Name/Function Function VREF Bank 8 IO TrueDiff_TX01p 8 IO


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    EP2A40 672-pin 724-pin 020-pin TX01p TX01n TX02n TX02p RX22p H20B2 AA19 AA23 AA30 AG27 PDF

    EP2C35

    Abstract: LVDS93 LVDS179
    Text: Cyclone II EP2C35 Device Pin-Out PT-EP2C35-1.9 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or


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    EP2C35 PT-EP2C35-1 LVDS93 LVDS179 PDF

    mark 3t1

    Abstract: EP2C50 LVDS54P LVDS93
    Text: Cyclone II EP2C50 Device Pin-Out PT-EP2C50-1.6 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or


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    EP2C50 PT-EP2C50-1 mark 3t1 LVDS54P LVDS93 PDF

    D9KG

    Abstract: marking code micron label marking aa5 152-Ball M2P20 MT46H64M32L2CG-6 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21
    Text: Preliminary‡ 152-Ball x32 LPDDR-SDRAM PoP TI-OMAP Features LPDDR-SDRAM 152-Ball Package-on-a-Package (PoP) TI-OMAP MT46HxxxMxxLxCG Features Options • Vdd/Vddq = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR)


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    152-Ball MT46HxxxMxxLxCG 09005aef833913f1/Source: 09005aef833913d6 D9KG marking code micron label marking aa5 M2P20 MT46H64M32L2CG-6 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21 PDF

    Untitled

    Abstract: No abstract text available
    Text: Pin Information for the Cyclone V 5CSEBA5 Device Version 1.2 Note 1 Bank Number 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3B 3B 3B 3B 3B 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A 5A


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Pin Information for the Cyclone V 5CSEBA5S Device Version 1.2 Note 1 Bank Number 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3B 3B 3B 3B 3B 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A


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    PDF

    bae rad750

    Abstract: RAD750 rad750 user manual bae RAD750 processor A22 CGA board ae09 cga 624 hs01 SECDED mcc w04
    Text: HS-01 12/2000 Version: 1.1 Technical Data 1 Power PCI PowerPC/PCI/Memory Controller Hardware Specifications The Power PCI chip developed by BAE SYSTEMS provides a radiation hardened PowerPC microprocessor common hardware reference platform CHRP compliant bridge between the PowerPC


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    HS-01 RAD750 bae rad750 rad750 user manual bae RAD750 processor A22 CGA board ae09 cga 624 hs01 SECDED mcc w04 PDF

    Untitled

    Abstract: No abstract text available
    Text: Pin Information for the Cyclone V 5CSEBA6S Device Version 1.2 Note 1 Bank Number 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3B 3B 3B 3B 3B 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A


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    PDF

    nec aa8

    Abstract: AA5 mark diagram U1203
    Text: DATA S H EET NEC MOS INTEGRATED CIRCUIT VR5000 64-BIT MICROPROCESSOR DESCRIPTION T h e mPD30500 V r5000 is a high-performance, 64-bit R IS C (Reduced Instruction Set Computer) type microproc­ essor employing the R IS C architecture developed by M IPS.


    OCR Scan
    VR5000TM 64-BIT uPD30500 Vr5000 UPD30500 /IPD30500 nec aa8 AA5 mark diagram U1203 PDF