capacitor vehicle mttf
Abstract: J-STD-020 S9730 ablebond 293 Nitto
Text: 05/27/2002 RELIABILITY REPORT FOR DS2153, A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
|
Original
|
DS2153,
MIL-STD-883-2004
capacitor vehicle mttf
J-STD-020
S9730
ablebond 293
Nitto
|
PDF
|
ablebond 163-4
Abstract: Ablebond 71 GaAs MMIC ESD, Die Attach and Bonding Guidelines HMMC-5023 ABLEBOND 55-1 Ablebond 190
Text: 23 GHz LNA 21.2 – 26.5 GHz Technical Data HMMC-5023 Features • Frequency Range: 21 .2 – 23.6 GHz and 24.5 – 26.5 GHz Specified 21– 30 GHz Performance • Low Noise Temperature: 226 K (2.5 dB N.F.) Typical • High Gain: 24 dB Typical • 50 Ω Input/Output Matching
|
Original
|
HMMC-5023
HMMC-5023
ablebond 163-4
Ablebond 71
GaAs MMIC ESD, Die Attach and Bonding Guidelines
ABLEBOND 55-1
Ablebond 190
|
PDF
|
tsmc design rule
Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
Text: Cypress Semiconductor Product Qualification Report QTP# 002105 VERSION 1.0 October, 2000 High Accuracy EPROM Programmable Single-PLL Clock Generator L28 Technology, CTI fab 2 and TSMC fab 2A, Taiwan CY2077 390 kHz - 133MHz at 5V 390 kHz -100 MHz at 3.3V CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
|
Original
|
CY2077
133MHz
CY2077SC/CY2077ZC
CY2280-OC
85C/85
tsmc design rule
1120008
tsmc
tsmc cmos
MIL-STD-883C method 2011
tsmc Activation Energy
tsmc cmos model
|
PDF
|
LCMXO2-1200
Abstract: CEL-9750ZHF CEL-9750ZHF10
Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The
|
Original
|
LCMXO2-1200-25WLCSP
LCMXO2-1200
CEL-9750ZHF
CEL-9750ZHF10
|
PDF
|
Ablebond 71-1
Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages DC resistance R of leads or pins Capacitance (C) including lead-to-lead and loading capacitances Inductance (L) including only self-inductance values for pins traces and wires (PGA) or
|
Original
|
93-WA-EEP-6
91-WA-EEP-27
91-WA-EEP-31
pp1059-1070
pp357-366
Ablebond 71-1
Nitto
bimetal
ABLEBONd 84-1
FR4 epoxy dielectric constant 4.4
thermal analysis on pcb
tungsten slug glass diode
Ablebond 71
IC Packages
cpu fan pin data circuit in mother board
|
PDF
|
CV-8710
Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Text: Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010
|
Original
|
JIG-101
CV-8710
EME-G770HCD
Sumitomo EME-G600 material
SUMITOMO EME G770
EME-G760
MGC CCL-HL832
EME-G600
CCL-HL832
sumitomo g770
Ablestik ablebond 3230 epoxy
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 0032745 13= • APX N AMER PHILIPS/DISCRETE b=)E OM 386M OM387M ^ HYBRID INTEGRATED CIRCUITS FOR INDUCTIVE PROXIMITY DETECTORS Hybrid integrated circuits intended for inductive proxim ity detectors in tubular construction, especially the MS hollow stud. The OM386M is for positive supply voltage and the OM387M is for
|
OCR Scan
|
OM387M
OM386M
OM387M
OM386B/OM387B
|
PDF
|
ablebond 293-1
Abstract: inductive proximity detector ic NEOSID p9 m8 neosid NEOSID neosid T D
Text: OM386M OM387M PHILIPS INTERNATIONAL SbE » 7110fl2b G O ^ O ^ Ö3fl H P H I N HYBRID INTEGRATED CIRCUITS FOR INDUCTIVE PROXIMITY DETECTORS Hybrid integrated circuits intended fo r inductive p ro xim ity detectors in tubular construction, especially the M8 hollow stud. The OM386M is fo r positive supply voltage and the OM387M is fo r
|
OCR Scan
|
OM386M
OM387M
7110fl2b
OM386B/OM387B
7Z6906&
ablebond 293-1
inductive proximity detector ic
NEOSID p9
m8 neosid
NEOSID
neosid T D
|
PDF
|
inductive proximity detector ic
Abstract: VD neosid ablebond 293-1 NEOSID NEOSID 22 metal detector coil DIAGRAM neosid 10 metal detectors IC neosid CAP OM386M
Text: • bbS3T31 0032745 13T H A P X N AMER PHILIPS/DISCRETE O M 386M O M 387M b'IE D HYBRID IN TE G R A TE D C IR C U IT S FOR IN D U C TIVE P R O X IM IT Y D E T E C T O R S Hybrid integrated circuits intended fo r inductive p ro xim ity detectors in tubular construction,
|
OCR Scan
|
bbS3T31
OM386M
OM387M
0M386M
OM387M
OM386B/OM387B
inductive proximity detector ic
VD neosid
ablebond 293-1
NEOSID
NEOSID 22
metal detector coil DIAGRAM
neosid 10
metal detectors IC
neosid CAP
|
PDF
|