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    ABLESTIK 2300 Search Results

    ABLESTIK 2300 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DA9230-07VZ2 Renesas Electronics Corporation Nanopower Buck Regulator for Low Power Connected Devices Visit Renesas Electronics Corporation
    iW3623-00 Renesas Electronics Corporation Flickerless™, Non-Dimmable 45W Solid-State Lighting LED Driver with High PF (>0.95), Low THD (<10%) and Low Output Ripple (<5%) (Two-Stage) Visit Renesas Electronics Corporation
    5L35023-000NLGI Renesas Electronics Corporation VersaClock® 3S Programmable Clock Generator Visit Renesas Electronics Corporation
    5X35023-000NXGI Renesas Electronics Corporation VersaClock® 3S Programmable Clock Generator with Integrated Crystal Visit Renesas Electronics Corporation
    5962-9223005M3A Renesas Electronics Corporation 8-BIT NON-INVERTING REGIS Visit Renesas Electronics Corporation

    ABLESTIK 2300 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    KEG1250LKDS

    Abstract: KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 Ablestik 2025D EME-G770 eme-g770lc
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-02 DATE: 3-Jun-2010 Product Affected: 13.5mm x 8.0mm x 1.1mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


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    PDF A1004-02 3-Jun-2010 FPBGA-176 3-Sep-2010 JESD22-A118 JESD22-A104 JESD22-A103 JESD22-A113 SSTE32882HLBAKG KEG1250LKDS KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 Ablestik 2025D EME-G770 eme-g770lc

    EME-G770

    Abstract: KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02R1 DATE: 18-Dec-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


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    PDF A0911-02R1 18-Dec-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG EME-G770 KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX

    KE-G1250

    Abstract: AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02 DATE: 20-Nov-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


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    PDF A0911-02 20-Nov-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG KE-G1250 AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG

    PCN0903

    Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of


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    PDF PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type

    nitto GE

    Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark


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    PDF A1008-07 TEBGA-580 facilitSD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 SXVX-110BHG SXVX-200BHG SXVX-210BHG nitto GE GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS

    CRM1076

    Abstract: BFG64 ablestik 8360 ICS8430EY EME-G700 Transistor BC 1078 IDT82V2058XDA Compound EME-G700 CRM1525D IDT75N43102S50BCG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0610-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 16-Oct-2006 MEANS OF DISTINGUISHING CHANGED DEVICES:


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    PDF A0610-02 16-Oct-2006 16-Jan-2007 Waf39FA MPC92469AC MPC92469FA MPC930FA MPC9315AC MPC9315FA MPC9330AC CRM1076 BFG64 ablestik 8360 ICS8430EY EME-G700 Transistor BC 1078 IDT82V2058XDA Compound EME-G700 CRM1525D IDT75N43102S50BCG

    ge100lfcsv

    Abstract: GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-03 Product Affected: DATE: September 10, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 19mm x 19mm CABGA-324 (Standard & Green)


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    PDF A1008-03 CABGA-324 89HPES12N3A2ZCBCI8 89HPES12N3AZCBC 89HPES12N3AZCBCG 89HPES12N3AZCBCI 89HPES12N3AZGBC 89HPES12N3AZGBCG 89HPES12N3AZGBCGI 89HPES12N3AZGBCI ge100lfcsv GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG

    IDT82V1671AJ

    Abstract: EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0601-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 21-Mar-2006 MEANS OF DISTINGUISHING CHANGED DEVICES:


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    PDF 21-Mar-2006 19-Jun-2006 IDTCV169NLG IDTCV170PAG IDTCV171NLG IDTCV174PAG IDTCV175PAG IDTNW1506AL IDTQS3VH16210PA IDTQS3VH16210PAG IDT82V1671AJ EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b

    CCL-HL832NX-A

    Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
    Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize


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    PDF CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832

    Amkor Wafer level mold compound

    Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
    Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm


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    l2aa

    Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
    Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement


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    PDF CO-029) l2aa tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


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    nitto GE

    Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
    Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application


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    deltabond 152

    Abstract: ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2
    Text: Thermal Design Considerations—EL75XX Application Note March 20, 1998 AN1096 Author: Vijay Soman Typical Applications Power Requirement Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors


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    PDF Considerations--EL75XX AN1096 EL7560/EL7561/EL7556 EL7560/EL7561 EL7556 Solutions--1994 deltabond 152 ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2

    M38UC

    Abstract: Stellex M38UC SM4T mixer M38UC-150 a56 transistor 952 STELLEX SFD25 M38DC-400 transistor MY51 transistor MY52 M38UC-400
    Text: M/A-COM, Inc. 1011 Pawtucket Blvd. Lowell, MA 01853-3295 RF and Microwave Products North America MSBU Component Operations Tel: 800.366.2266 Fax: 800.618.8883 Europe/Africa/Middle East Tel: 44.1344.869.595 Fax: 44.1344.300.020 Asia/Pacific Tel: 81.44.844.8296


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    PDF MA-C-05010007 M38UC Stellex M38UC SM4T mixer M38UC-150 a56 transistor 952 STELLEX SFD25 M38DC-400 transistor MY51 transistor MY52 M38UC-400

    CD 5888 CB SMD IC

    Abstract: toshiba laptop battery pack pinout laptop inverter board schematic toshiba Sumitomo CRM 1033B Ablestik LMISR4 J-K Flip-Flop 7676 lcx 574 toshiba laptop schematic diagram semiconductors cross reference SN74LVC4245DB
    Text: DATA SHEET CLASSIFICATIONS Product Preview This heading on a data sheet indicates that the device is in the formative stages or in design under development . The disclaimer at the bottom of the first page reads: “This document contains information on a product under development. Motorola reserves the


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    PDF cont18 BR1339 BR1339/D CD 5888 CB SMD IC toshiba laptop battery pack pinout laptop inverter board schematic toshiba Sumitomo CRM 1033B Ablestik LMISR4 J-K Flip-Flop 7676 lcx 574 toshiba laptop schematic diagram semiconductors cross reference SN74LVC4245DB

    HMXR-5001

    Abstract: 13001 YF 09 TRANSISTOR HP 5082 7000 5082-0825 33150A 2N6838 Hxtr 3101 Hxtr 3101 transistor 5082-2815 hsch-1001
    Text: For Complete . Application &Sales . '. Information ' ,.' • Call ' Joseph Masarich Sales Representative HEWLETT PACKARD . NEELY "Sales Region 3003 scon BLVD. SANTA CLARA, CA 95050 408 988-7234 Microwave Semiconductor Diode and Transistor Designers Catalog


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    HRMA-0470B

    Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
    Text: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic


    OCR Scan
    PDF E-28230 S-164 CH-8902 HRMA-0470B Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61